LED packaging structure and packaging method

A technology of LED encapsulation and encapsulation colloid, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of difficulty in controlling the ink color consistency of the LED module shell, affecting the appearance of the LED display device, and the high rate of defective packaging structures. Save the high temperature welding process, save the amount of packaging glue, and facilitate the effect of automatic production

Inactive Publication Date: 2007-08-08
深圳市联众达光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the LED module is packaged as a whole, if there is uneven brightness or dead spots at individual light source points, the entire module will be scrapped, causing great waste and increasing production and maintenance costs
Moreover, the encapsulation glue that is packaged into one will generate internal stress, and the molded module colloid will have a certain degree of depression in the middle of the module due to shrinkage, and there will be more serious color block phenomenon after it emits light, that is, the light-emitting directio

Method used

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  • LED packaging structure and packaging method
  • LED packaging structure and packaging method

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Embodiment Construction

[0040] As shown in FIG. 1 , the present invention provides an LED packaging structure, which includes a circuit board 1 , several LED light emitting units, packaging colloid 3 and fixing colloid 4 .

[0041] Wherein, the front of the circuit board 1 is preset with several bonding positions for bonding LED light-emitting chips thereon. On the circuit board 1, there is at least one glue hole 10 penetrating through the circuit board 1 in each LED light-emitting unit, which can not only be used for glue during packaging, but also for wiring; the back of the circuit board 1 is provided with a port 12 connected to an external circuit , in the embodiment shown in the figure, the port 12 is a port in the form of pins.

[0042] As shown in Figure 2, the front side of the circuit board 1 is also equipped with a mask 5, and the mask 5 is provided with through holes 50 corresponding to each LED light emitting unit so that each LED light emitting unit is exposed from the corresponding thro...

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Abstract

The invention relates to one LED sealing structure, which comprises circuit board, several LED light units on circuit front, wherein, the circuit board back is set with terminal to outer circuit. The invention also provides one LED sealing method, which comprises the following steps: processing special mode board; binding LED light chip; mode loading with down mode board facing down with each LED light unit contained into each module particle; glue injecting and fixing step.

Description

technical field [0001] The invention relates to an LED package structure and a package method. Background technique [0002] Due to the characteristics of LED light source, such as low power consumption, long life, sensitive response, and no toxic substances, this new type of energy-saving and environmentally friendly light source has been widely used, such as in backlight, display screen, car lights and various landscape lighting. place etc. [0003] At present, the packaging methods of LED mainly include: in-line LED lamp with bracket, SMD LED lamp and integrated LED module. [0004] The in-line LED light is composed of light-emitting chips, copper or iron brackets, and epoxy resin. It is characterized by various forms, easy replacement, and a wide range of light-emitting angles. It can be used as a point light source, and can be used as a surface light source when multiple modules form a module. , line light source. Bracket-type LED lamps need to be inserted and welded...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L25/075H01L23/31H01L21/50H01L21/56
Inventor 周政祥
Owner 深圳市联众达光电有限公司
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