Electroconductive resin composition, production method and use thereof
A technology of resin composition and conductive resin, applied in the direction of conductive adhesives, conductive coatings, adhesive additives, etc., can solve the problem of inability to form a conductive network, and achieve the effect of good surface smoothness
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Embodiment 1
[0112] Using a Labo-Plastmill (manufactured by Toyo Seiki Co., Ltd.) at 240°C and 80 rpm, 90% by mass of polycarbonate resin (Iupilon H4000 manufactured by Mitsubishi Gas Chemical Company, Inc.) and 10% by mass of Carbon fiber 1 ten minutes (mixing energy: 850MJ / m 3 ), and then using a 50t thermoforming device (manufactured by Nippo Engineering Co.Ltd.) at a temperature of 250°C, 200kgf / cm 2 It was molded into a plate of 10 mm x 10 mm x 2 mm under the conditions of pressure and 30 seconds, whereby Composition 1 was obtained. An optical micrograph of the cross-section of the plate is shown in Figure 1, and the results of the analysis of the diameter of the agglomerates in the micrograph are shown in Figure 2.
Embodiment 2
[0114] In the same manner as in Example 1, polycarbonate resin (Iupilon H4000 manufactured by Mitsubishi Gas Chemical Company, Inc.) and carbon fiber 2 (mixing energy: 950 MJ / m 3 ), and then molded, thus obtaining composition 2.
Embodiment 3
[0116] In the same manner as in Example 1, polycarbonate resin (Iupilon H4000 manufactured by Mitsubishi Gas Chemical Company, Inc.) and carbon fiber 3 (mixing energy: 820 MJ / m 3 ), and then molded, thus obtaining composition 3.
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