Electroconductive resin composition, production method and use thereof

A technology of resin composition and conductive resin, applied in the direction of conductive adhesives, conductive coatings, adhesive additives, etc., can solve the problem of inability to form a conductive network, and achieve the effect of good surface smoothness

Inactive Publication Date: 2007-08-15
RESONAC HOLDINGS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the mass of agglomerates cannot be further reduced into finer blocks by kneading methods using standard extruders, and therefore a conductive network cannot be formed without the addition of large amounts of fillers

Method used

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  • Electroconductive resin composition, production method and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0112] Using a Labo-Plastmill (manufactured by Toyo Seiki Co., Ltd.) at 240°C and 80 rpm, 90% by mass of polycarbonate resin (Iupilon H4000 manufactured by Mitsubishi Gas Chemical Company, Inc.) and 10% by mass of Carbon fiber 1 ten minutes (mixing energy: 850MJ / m 3 ), and then using a 50t thermoforming device (manufactured by Nippo Engineering Co.Ltd.) at a temperature of 250°C, 200kgf / cm 2 It was molded into a plate of 10 mm x 10 mm x 2 mm under the conditions of pressure and 30 seconds, whereby Composition 1 was obtained. An optical micrograph of the cross-section of the plate is shown in Figure 1, and the results of the analysis of the diameter of the agglomerates in the micrograph are shown in Figure 2.

Embodiment 2

[0114] In the same manner as in Example 1, polycarbonate resin (Iupilon H4000 manufactured by Mitsubishi Gas Chemical Company, Inc.) and carbon fiber 2 (mixing energy: 950 MJ / m 3 ), and then molded, thus obtaining composition 2.

Embodiment 3

[0116] In the same manner as in Example 1, polycarbonate resin (Iupilon H4000 manufactured by Mitsubishi Gas Chemical Company, Inc.) and carbon fiber 3 (mixing energy: 820 MJ / m 3 ), and then molded, thus obtaining composition 3.

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Abstract

The electroconductive resin composition comprising 1 to 30 mass % of carbon fiber having a hollow structure, an average filament diameter of 50 to 500 nm and an average aspect ratio of 50 to 1000 and 99 to 70 mass % of resin, wherein the volume ratio of carbon fiber agglomerate to one carbon fiber filament constituting the agglomerate in the resin composition(volume of carbon fiber agglomerate / volume of a carbon fiber filament) is 1500 or less according to the invention can be uniformly dispersed in resin without agglomeration and therefore, a good electroconductivity can be achieved by addition of small amount of the composition.

Description

[0001] Cross References to Related Applications [0002] 60 / 611,267, filed September 21, 2004, under 35 U.S.C. Section 111(b) as required by 35 U.S.C.Section 119(e)(1), hereby filed pursuant to 35 U.S.C. Section 111(a). Right to Provisional Application. technical field [0003] The present invention relates to a conductive resin composition which can be uniformly dispersed in a matrix of resin such as thermoplastic resin, thermosetting resin or photocurable resin without forming agglomerates of conductive filler in the matrix. [0004] More specifically, the present invention relates to a conductive resin composition and a production method thereof, wherein by using carbon fibers having very few branches (prepared by adjusting the raw material composition and raw material concentration during the reaction), the agglomeration of the carbon fibers enables It is easily released without breaking the filaments when mixed with the resin, and can form a three-dimensional network st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08J3/20C08K3/04C09D201/00C09J201/00C09D7/61C09D7/65
CPCC09J11/04C08K3/04C08K7/06C08J5/042C09D5/24C09D7/1291C09D7/1266C09J9/02C09D7/1275C08K2201/016C09D7/67C09D7/68C09D7/70C09D7/65C09D7/61
Inventor 长尾勇志山本龙之
Owner RESONAC HOLDINGS CORPORATION
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