Optical module heat radiation device and radiator and communication device

A technology for a heat dissipation device and a communication device, which is applied to lasers, laser parts, semiconductor lasers, etc., can solve the problems of not effectively improving the heat dissipation effect of the optical module, and the contact effect is not good, so as to improve the heat dissipation effect and enhance the contact effect. Effect

Inactive Publication Date: 2007-09-12
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the optical module itself cannot meet the heat dissipation requirements, the existing technology adopts the form of heat sink + buckle to enhance heat dissipation
[0004] However, in the above solution, since the contact effect between the heat sink and the optical module is not good, the heat dissipation effect of the optical module cannot be effectively improved.

Method used

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  • Optical module heat radiation device and radiator and communication device
  • Optical module heat radiation device and radiator and communication device
  • Optical module heat radiation device and radiator and communication device

Examples

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Embodiment Construction

[0016] Embodiments of the present invention provide a cooling device for an optical module, a heat sink, and a communication device, which are used to effectively dissipate heat for the optical module.

[0017] The embodiments of the present invention mainly improve the heat dissipation efficiency of the heat sink by reducing the contact thermal resistance between the heat sink and the optical module.

[0018] Referring to Fig. 2, the radiator embodiment in the embodiment of the present invention is:

[0019] The heat sink includes a heat dissipation layer 203 and a heat-absorbing surface 202 at the bottom. Several curved reeds 201 are inlaid on the heat-absorbing surface 202. Since the curved reeds 201 are compressible, they can achieve close contact with the optical module. , improve cooling efficiency.

[0020] The curved reed 201 before installation is in a natural state. During the installation of the optical module, the curved reed 201 will be deformed. The curved reed ...

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Abstract

The invention discloses an optical module heat radiating device and a heat radiator as well as a communication device, for improving the optical module heat radiating effect. And the device is used to radiate heat from the optical module and comprises: heat radiator, optical module case and heat radiator fastener, where heat absorbing surface of the heat radiator is equipped with several elastic pieces whose elastic force directions are basically vertical to the heat absorbing surface; the optical module case is equipped with several elastic parts; the heat radiator fastener is equipped with open holes matching with the elastic parts. In addition, the invention also provides a heat radiator and a communication device. And the invention can effectively improve optical module heat radiating effect.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a cooling device for an optical module, a radiator and a communication device. Background technique [0002] The optical module plays an important role in the optical fiber communication process, but a large amount of heat will be generated during the communication. In order to ensure the normal operation of the optical communication, the heat generated by the optical module needs to be dissipated in time. [0003] A cooling device for an optical module in the prior art is shown in FIG. 1 , and is specifically composed of an optical module 101 , a heat sink 102 , an optical module housing 103 , a heat sink buckle 104 , and an external cable 105 . Such an optical module needs to be pluggable. If the optical module itself cannot meet the heat dissipation requirements, the existing technology adopts the form of heat sink + buckle to enhance heat dissipation. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/02H05K7/20H01S5/024
Inventor 方雯
Owner HUAWEI TECH CO LTD
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