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Semiconductor storage device

A technology of memory devices and semiconductors, applied in semiconductor devices, static memories, electric solid state devices, etc., can solve problems such as reducing integration

Inactive Publication Date: 2007-10-03
YAMAHA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] According to the prior art described above, since each memory cell constituting the memory cell array has a transistor 1010 for setting initial data, a large number of transistors constitute the memory cell, so that the degree of integration will be significantly reduced.

Method used

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  • Semiconductor storage device
  • Semiconductor storage device
  • Semiconductor storage device

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Experimental program
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Embodiment Construction

[0023] The principle of an embodiment of the present invention will be described below with reference to FIGS. 1 to 3 .

[0024] FIG. 1 is a circuit diagram for explaining data storage in a semiconductor memory device according to a first embodiment of the present invention. 2 is a circuit diagram for explaining setting of initial data (logic value "1") in the semiconductor memory device according to the first embodiment of the present invention. 3 is a circuit diagram for explaining setting of initial data (logic value "0") in the semiconductor memory device according to the first embodiment of the present invention. In the drawings, the same numerals denote the same elements, and explanations for the same elements will not be repeated.

[0025] As shown in FIG. 1, the memory cell has the same electrical structure as a general SRAM memory cell according to the prior art. For example, a memory cell according to an embodiment of the present invention is mainly composed of a f...

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Abstract

A semiconductor storage device comprises a memory cell array having memory cells arranged in a matrix, each memory cell mainly composed of a flip-flop formed of a pair of cross-coupled inverters, a first wiring configured to each row and each column of the memory cell array and connected to a predetermined power supply node, a second wiring configured in parallel to the first wiring, and a switching circuit that is connected between the power supply node and the second wiring and opens when initial data is set to the memory cells, wherein a receiving node of each pair of inverters is selectively connected to the first wiring or the second wiring in accordance with a logical value of initial data to be set to each one of the plurality of the memory cells belonging to each row and each column of the memory cell array.

Description

[0001] Cross References to Related Applications [0002] This application is based on Japanese Patent Application No. 2006-098035 filed on March 31, 2006, the entire contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a semiconductor memory device, and more particularly, to a Static Random Access Memory (SRAM) capable of automatically setting initial data to memory cells. Background technique [0004] Generally, a static random access memory (SRAM) that can set predetermined initial data to a memory cell is known (refer to Japanese Laid-Open Patent No. 2005-85399). [0005] FIG. 9 shows the structure of a memory cell 1000 equipped to that kind of SRAM. The memory cell 1000 is composed of a flip flop formed by a pair of cross-coupled inverters 1001 and 1002, a transmission gate formed by transistors 1004 and 1006, and a transistor 1010 for setting initial data. Also, each of the inverters 1001 and 1002 is constit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/41
CPCG11C11/412H01L27/0207H01L27/1104H10B10/12
Inventor 平井良康镰田义彦
Owner YAMAHA CORP