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Radiator and its manufacturing method, electronic equipment with radiator

A technology for electronic equipment and heat sinks, applied in circuits, electrical components, electric solid devices, etc., can solve the problem that the ratio of the length of the screw-like fins to the circumference cannot be made too large, the cost, efficiency and reliability of the heat sink are low, and the system Unsmooth flow field and heat dissipation requirements, etc., to achieve low thermal resistance and flow resistance, large design flexibility, and good heat dissipation effect

Inactive Publication Date: 2007-10-03
东莞市均晖五金制品有限公司
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  • Abstract
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Problems solved by technology

[0007] Affected by the process, the cost, efficiency and reliability of the heat sink are relatively low, and the ratio of the length of the screw-shaped fin to the circumference cannot be made too large, so that the fin cannot be made small enough to maintain a constant volume. In some cases, the surface area is not large enough to make the thermal resistance small enough to meet some heat dissipation requirements, such as: the heat dissipation requirements of the harsh heat dissipation environment where the electronic heating source has a large heating power and the system flow field is not smooth

Method used

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  • Radiator and its manufacturing method, electronic equipment with radiator
  • Radiator and its manufacturing method, electronic equipment with radiator
  • Radiator and its manufacturing method, electronic equipment with radiator

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Embodiment Construction

[0025] In the heat sink and its manufacturing method provided by the embodiments of the present invention, the base plate and the columnar fins of the heat sink are formed separately, and then the columnar fins of the heat sink are fixed on the base plate by welding or bonding to form a complete heat dissipation system. The radiator as a whole, or directly fixed into a whole radiator by mechanical means such as screws, can change the shape and array pattern of the columnar fins according to the actual application environment to design different radiator flow channels to achieve a good heat dissipation effect.

[0026] The technical solutions of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0027] Referring to FIG. 3 , a schematic structural view of a heat sink according to an embodiment of the present invention is illustrated; according to this figure, a heat sink includes at least a substrate 1 and a...

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Abstract

The invention discloses a kind of radiator, including at least: a substrate and at least a columnar fins which includes a cylinder and a column cap of at the bottom of the cylinder, in which, the bottom of the column cap and the upper surface of the substrate are fixed, and the column cap and the cylinder form a step-shape. Accordingly, the present invention also discloses a method for manufacturing the radiator, including: it makes each cylinder of the columnar fins go through the corresponding hole on the cover, and makes the column cap connect with the bottom of the cover. And then it fixes the cover on the substrate. In addition, the invention also discloses a kind of electronic equipment with this kind of radiator.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a heat sink, a manufacturing method thereof, and an electronic device with the heat sink. Background technique [0002] With the continuous development of electronic technology, the thermal power consumption of electronic equipment or devices continues to increase, and overheating of electronic equipment or devices will cause a series of problems, such as: it will affect the life of electronic equipment or devices and the stability of the entire system. As the heat dissipation environment becomes more and more harsh, electronic heat dissipation technology has become a bottleneck that seriously restricts the development of electronic technology. [0003] In order to solve the problem of overheating of electronic equipment or devices, heat sinks are generally installed on electronic heating sources, such as CPU, power crystal, power supply, etc., so that the heat g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34
CPCH01L2924/0002
Inventor 杨右权
Owner 东莞市均晖五金制品有限公司
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