Low-density plank, and production technique
A production process and low-density technology, applied in the field of boards, can solve problems such as high water absorption thickness expansion rate, poor bending resistance, poor flexural performance, formaldehyde release pollution, etc., to achieve improved raw material utilization, good sound insulation, and sizing volume low effect
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Embodiment 1
[0031] Example 1. A low-density board that uses wheat straw and rice straw as raw materials, and uses isocyanate resin adhesives, urea-formaldehyde resin adhesives, phenolic resin adhesives, a mixture of isocyanate resin adhesives and urea-formaldehyde resin adhesives, or a mixture of isocyanate resin adhesives and phenolic resin adhesives as raw materials Binder, processed into a density of 200Kg / m 3 Low density board.
Embodiment 2
[0032] Example 2. A low-density board that uses wheat straw and rice straw as raw materials, and uses isocyanate resin adhesives, urea-formaldehyde resin adhesives, phenolic resin adhesives, a mixture of isocyanate resin adhesives and urea-formaldehyde resin adhesives, or a mixture of isocyanate resin adhesives and phenolic resin adhesives as raw materials Binder, processed into a density of 550Kg / m 3 Low density board.
Embodiment 3
[0033] Example 3. A low-density board that uses wheat straw and rice straw as raw materials, and uses isocyanate resin adhesives, urea-formaldehyde resin adhesives, phenolic resin adhesives, a mixture of isocyanate resin adhesives and urea-formaldehyde resin adhesives, or a mixture of isocyanate resin adhesives and phenolic resin adhesives as raw materials Binder, processed into a density of 450Kg / m 3 Low density board.
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