Low-density plank, and production technique

A production process and low-density technology, applied in the field of boards, can solve problems such as high water absorption thickness expansion rate, poor bending resistance, poor flexural performance, formaldehyde release pollution, etc., to achieve improved raw material utilization, good sound insulation, and sizing volume low effect

Inactive Publication Date: 2007-10-10
江苏大盛板业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current domestic low-density board technology and products are mainly low-density wood fiber boards produced by wet process. The water pollution of this technology is extremely serious in the production process. The folding performance is poor, and there are disadvantages such as formaldehyde release and pollution. The wet process has been listed as an obsolete technology by the National Development and Reform Commission

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Example 1. A low-density board that uses wheat straw and rice straw as raw materials, and uses isocyanate resin adhesives, urea-formaldehyde resin adhesives, phenolic resin adhesives, a mixture of isocyanate resin adhesives and urea-formaldehyde resin adhesives, or a mixture of isocyanate resin adhesives and phenolic resin adhesives as raw materials Binder, processed into a density of 200Kg / m 3 Low density board.

Embodiment 2

[0032] Example 2. A low-density board that uses wheat straw and rice straw as raw materials, and uses isocyanate resin adhesives, urea-formaldehyde resin adhesives, phenolic resin adhesives, a mixture of isocyanate resin adhesives and urea-formaldehyde resin adhesives, or a mixture of isocyanate resin adhesives and phenolic resin adhesives as raw materials Binder, processed into a density of 550Kg / m 3 Low density board.

Embodiment 3

[0033] Example 3. A low-density board that uses wheat straw and rice straw as raw materials, and uses isocyanate resin adhesives, urea-formaldehyde resin adhesives, phenolic resin adhesives, a mixture of isocyanate resin adhesives and urea-formaldehyde resin adhesives, or a mixture of isocyanate resin adhesives and phenolic resin adhesives as raw materials Binder, processed into a density of 450Kg / m 3 Low density board.

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PUM

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Abstract

A low-density (200-550 Kg/cu.m) board is prepared from rice and wheat straws and the adhesive which is the mixture of isocyanate resin and urealdehyde resin or phenolic resin through pretreating, applying adhesive and hot pressing.

Description

Technical field [0001] The invention relates to a board, especially a low-density board; the invention also relates to a production process of the low-density board. Background technique [0002] At present, the domestic low-density board technology and products are mainly low-density wood fiberboard with wet process. This technology has extremely serious water pollution during the production process. Its products have high water absorption thickness and expansion rate in 2 hours, low internal bonding strength, bending resistance, and Poor folding performance, formaldehyde emission pollution and other shortcomings, the wet process has been listed as an obsolete technology by the National Development and Reform Commission. The technology of using straw as raw material to produce wood-based panels has just begun to develop. There has not been a mature low-density straw board production technology that has appeared and has been industrialized. This technology can effectively use whe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/02B27N1/02B27N1/00B27N3/10B27N3/08B27N3/18
Inventor 朱国铭程海龙庄严
Owner 江苏大盛板业有限公司
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