Heat pipe and its combining method with heat-conductive base

Abstract

A bonding method for heat conduction pipe and heat conduction base includes: through arranging at least a group of holes on a heat conduction substrate body, or any one of valley and protrusion formed opposite to the group holes for collocation on at least on surface thereof; penetrating most heat conduction pipes in the group holes; implementing urgent forming procedure, i.e. coupling a machining tool having at least a pressing piece and forcibly pressure exertion technology, exerting force to the surface of the heat conduction substrate, the valley or the protrusion to squeeze them to bond the heat conduction pipe and the heat conduction base, and then implementing a bending procedure, i.e. bending the heat conduction pipe for a predetermined angle for penetrating and bonding most radiation fins; finishing the radiation device and applying the same in radiation for electronic assembly heat bonding.

Description

technical field [0001] The present invention relates to a combination method of a heat pipe and a heat conduction base, especially a non-clamping type threading tight and seamless forming method that combines the heat pipe and the heat conduction base into one body, so as to improve the tightness of the combination and make it good rate, and make a heat sink with high bonding and heat transfer efficiency. Background technique [0002] It is known that the heat dissipation devices currently used in electronic components, especially the heat dissipation devices that require better heat dissipation efficiency, are all heat dissipation devices composed of heat pipes and heat dissipation fins to quickly transfer the heat generated by electronic components for large-area cooling. The heat dissipates, and the heat pipe is designed to meet the requirements of space configuration and the heat transfer efficiency of the better area. It also conducts heat quickly by combining a heat-co...

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Problems solved by technology

[0008] Each of the above-mentioned patents utilizes grooves on the base to match a cladding plate (or fixed plate, etc.), or further uses a convex portion that can be bent and deformed by external force to press the cladding plate to clamp the cladding plate to combine the heat pipe and the heat pipe. The base, the above clamping molding methods, are likely to produce gaps between the heat pipe and the base, in other words, the mutual closeness and tightness are not enough, of course, it also directly affects the heat transfer efficiency

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