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A method for manufacturing the ringing membrane of capacitance microphone element

A technology for condenser microphones and components, which is applied in the field of making diaphragms of condenser microphone components, can solve the problems of consumption, low yield and uniformity, high cost and time, etc.

Inactive Publication Date: 2011-10-12
中国台湾格雷蒙股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the plastic diaphragm produced by stamping not only has a low yield and uniformity, but also the traditional method of assembling the diaphragm with spacers after the completion of the condenser microphone element is more costly and time consuming.

Method used

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  • A method for manufacturing the ringing membrane of capacitance microphone element
  • A method for manufacturing the ringing membrane of capacitance microphone element
  • A method for manufacturing the ringing membrane of capacitance microphone element

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Embodiment Construction

[0015] Please refer to Figure 1 to Figure 9 . Figure 1 to Figure 9 Schematic illustration of a method of fabricating a diaphragm for a condenser microphone element in accordance with a preferred embodiment of the present invention. like figure 1 As shown, first, a substrate 10, such as a semiconductor wafer, is provided. Subsequently, a dielectric layer 12 is formed on the first surface of the substrate 10 , wherein silicon oxide is selected as the material of the dielectric layer 12 in this embodiment, and its thickness is about 4 microns.

[0016] like figure 2 As shown, a silicon layer 14 is then formed on the surface of the dielectric layer 12, wherein polysilicon formed by deposition is selected as the material of the silicon layer 14 in this embodiment, and its thickness is about 10 microns, and the stress value of the silicon layer 14 is controlled at the dielectric Below about 10 MPa, but the method of the present invention is not limited thereto. Materials such ...

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Abstract

The disclosed preparation method for vibration film of capacitor-type microphone comprises: providing a substrate with dielectric layer on its first surface; then, forming multiple silicon gaps on the dielectric layer; patterning the dielectric layer to form multiple dielectric blocks and then form the vibration film layer with fold structure; forming multiple opening opposite to the fold structure on the second surface, and removing these openings to expose the dielectric blocks.

Description

technical field [0001] The invention relates to a method for manufacturing a diaphragm of a capacitive microphone element, in particular to a method for manufacturing a diaphragm with a silicon spacer and a wrinkle structure. Background technique [0002] The condenser microphone element includes a parallel capacitor formed by the diaphragm and the back plate. When the diaphragm vibrates under sound pressure, the capacitance between the diaphragm and the back will change, thereby converting the sound signal into a voltage signal. Generally speaking, condenser microphone elements are mainly divided into two types: electret (electret) and condensation (condenser). For condenser microphone elements, since the diaphragm is used to sense sound pressure, the It must have good uniformity, so that it can sensitively and accurately reflect the sound size and vibration frequency. [0003] The diaphragms of traditional condenser microphone elements are mostly made of plastic and stamp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R29/00
Inventor 何宪龙
Owner 中国台湾格雷蒙股份有限公司