Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Stump chip preparation method

A technology of wood chips and tree stumps, which is applied in the field of fiberboard wood chip manufacturing, can solve the problems of ignoring the full utilization of wooden tree stumps, difficulty in processing, and affecting people's normal use, and achieve high processing efficiency, easy purchase, and large amount of wood chips.

Inactive Publication Date: 2007-10-31
SHANDONG HEYOU GROUP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the past, people concentrated fiberboard raw materials on sub-small fuelwood, branch wood and agricultural straw, ignoring the full utilization of a large number of wooden tree stumps.
The large tree stumps also affect people's normal use because they are not easy to process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0006] The acquired tree stumps are processed into wood chips by the following preparation methods:

[0007] 1. Classification and removal of impurities; classification by species to remove impurities and soil.

[0008] 2. Cutting: those that can enter the slicer can be sliced ​​directly, and those that cannot enter the slicer can be cut into 20×40mm or 30×60mm saw blocks with a vertical band saw, depending on the specification of the feed port of the slicer.

[0009] 3. Slicing: use a 218 or 216 large-scale slicer to slice, the gap between the cutters is 2mm, and the cut wood chips are 3mm in length and 2mm in width.

[0010] 4. Pulping by thermal grinding; mixing with sub-small fuelwood chips at a ratio of 5:5, and evenly sending them to a thermal grinding machine for pulping.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the artificial board making using stub slices. It comprises categorizing and eliminating impurities, cutting, slicing, chopping, heat grinding into serums. It uses easy accessed material, high in economical gains.

Description

technical field [0001] The invention relates to a fiberboard chip manufacturing technology. Background technique [0002] At present, my country has become a big country in the production and consumption of wood-based panels. By 2004, my country's wood-based panel production has ranked first in the world. However, my country is a country with very scarce forest resources, and the per capita forest stock volume is only 14.6% of the world's average level. The shortage of raw materials for wood-based panels has become an increasingly prominent problem. Many fiberboard and particleboard companies cannot maintain normal production due to raw material problems. The intensified contradiction between the supply and demand of timber resources has caused the price of wood-based panel raw materials to rise year by year, and the profit margins of enterprises have become smaller and smaller, and many enterprises have suffered losses. Therefore, maximizing the use of existing raw mater...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/00B27L5/00B27L11/08
Inventor 陈立言
Owner SHANDONG HEYOU GROUP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products