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Dry film corrosion resisting agent

A technology of resist and dry film, which is applied in the manufacture of instruments, electrical components, and printed circuits, etc., and can solve the problems of dry film resist resolution, adhesion damage, inability to fully adapt to narrow spacing, and limitations , to achieve the effects of excellent overdevelopability, good dispersion stability and excellent cohesiveness

Inactive Publication Date: 2007-11-21
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to adapt to the increased metal plating thickness, there are also cases where an attempt is made to use a thick dry film resist, but in this method, the resolution and adhesion of the dry film resist are impaired. Pitch wiring patterns are limited in the manufacture of
[0007] Regarding the peelability of dry film resists, for example, a method containing a specific carboxyl group-containing binder component (refer to Patent Document 1 and Patent Document 2) has been proposed, which is effective in miniaturizing the size of the release sheet. However, there is still room for research on the peeling and removability after metal plating
In addition, a method of combining a binder resin having a branched side chain structure with a monomer has been proposed (refer to Patent Document 3), which is important for the peeling and removability of the dry film resist when the plating protrudes from the metal plating. It is effective, but the current situation cannot fully adapt to the narrow pitch in recent years in terms of resist fine line adhesion

Method used

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  • Dry film corrosion resisting agent
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~6

[0098] (Examples 1-6, Comparative Examples 1-3)

[0099]

[0100] The composition of the photopolymerizable resin composition used in the Example and the comparative example is shown in Table 1 mentioned later.

[0101] Hereinafter, the preparation method of the evaluation sample of the Example and the comparative example, and the evaluation method and evaluation result with respect to the obtained sample are demonstrated.

[0102] 1. Preparation of samples for evaluation

[0103] The dry film resists in Examples and Comparative Examples were prepared as follows.

[0104]

[0105] First, prepare the adhesive as shown below.

Synthetic example

[0107] Under a nitrogen atmosphere, 300 g of methyl ethyl ketone was charged into a 1000 cc four-necked flask equipped with a nitrogen gas inlet, a stirring blade, a Dimroth condenser (Dimroth condenser) and a thermometer, and the temperature of the hot water bath was raised to 80°C. Then, methacrylic acid / styrene / acrylic acid-2-ethylhexyl ester / methacrylic acid-2-hydroxyethyl ester are formulated into a total of 400g with the combination ratio of 30 / 40 / 20 / 10 (mass ratio) respectively The solution was added to the flask under nitrogen atmosphere. To this preparation liquid, a solution obtained by dissolving 3 g of azobisisobutyronitrile in 30 g of methyl ethyl ketone was added dropwise over 2 hours while stirring. Thereafter, polymerization was carried out for 6 hours (initial polymerization).

[0108] Then, 6 g of azobisisobutyronitrile was dissolved in 30 g of methyl ethyl ketone to form a solution that was added dropwise three times, once every 4 hours, and then heated and...

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Abstract

A resist of dry film is prepared from 30-80mass% of binder containing carboxyl, 15-60mass% of monomer enabling to be photo-polymerized and 0.01-20mass% of photo-polymerization initiator. It is featured as arranging specific structure for binder containing carboxyl and monomer enabling to be photo-polymerized.

Description

technical field [0001] The present invention relates to an alkali-developable dry film resist containing a carboxyl group-containing binder having a specific structure and a monomer capable of specific photopolymerization. More specifically, the present invention relates to a dry film resist used in the manufacture of printed circuit boards (also referred to as printed circuit boards, circuit substrates), lead frames, semiconductor packages, etc., metal In the fields of precision machining and other fields, it is used as a dry film resist material such as a resist or a plating resist. It has particularly high resolution, adhesion and resist stripping, and it also has a The property of being excellent in dispersion stability also relates to a method of manufacturing a printed wiring board using the dry film resist. Background technique [0002] In recent years, with the acceleration of thinner, thinner and smaller electronic devices such as personal computers and mobile phon...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/028G03F7/033G03F7/20G03F7/30H05K3/00
Inventor 有久慎司冈田祐二
Owner ASAHI KASEI E-MATERIALS CORPORATION