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Thin film removing method and apparatus

A film and equipment technology, applied in the field of plasma removal film, can solve the problems of increased cost, inconvenient turning of large-sized panels, and easy bending of large-sized panels, and achieves the effect of improving the yield rate, high industrial utilization value, and saving manufacturing costs.

Inactive Publication Date: 2007-11-28
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although the surface of the liquid crystal panel looks flat, it has many microstructures. The photoresist on the front side of the microstructure can be easily removed by the plasma that is directed toward the panel surface. However, it is difficult to completely remove the photoresist on the side of the microstructure. to clear
In addition, due to the increasing demand for large-sized panels, it will be extremely inconvenient to turn over large-sized panels during the process. A special hanging machine must be designed to fix the panels, which will increase the cost, and large panels will easily bend due to suspension

Method used

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  • Thin film removing method and apparatus
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  • Thin film removing method and apparatus

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Embodiment

[0026] 2A to 2C are the removal method of the film of the present invention.

[0027] As shown in Figure 2A, the removal method of thin film of the present invention is used for removing thin film 30 on a substrate 3, wherein, this substrate 3 can be a liquid crystal panel, and this thin film 30 can be the photoresist on the liquid crystal panel surface .

[0028] As shown in Figure 2B, at first, a plasma generator 21 and an air extraction device 22 are provided above the substrate 3, the gas used by the plasma generator 21 can be dry clean air (Clean dry air) or Nitrogen (N 2 ), and generate plasma under normal atmospheric conditions.

[0029] Next, adjust the plasma generator 21 so that the plasma beam 210 ejected obliquely hits the thin film 30, the air extraction device 22 is arranged on the reflection path corresponding to the plasma beam 210, and the thin film 30 passes through the plasma beam. After the beam 210 reacts, the unreacted by-products 30' can be sucked awa...

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Abstract

The invention discloses a removing method of thin film and device, which is characterized by the following: arranging an electric plasma generator and an air pumping device on the upper of the chip; inclined-ejecting the electric plasma of the electric plasma generator to the thin film; locating the air pumping device on the refluxing path of the electric plasma; absorbing the thin film; proceeding electric plasma reaction; generating by-product; keeping clean for the surface of the chip. This method can increase fine ratio of LCD panel and can save the cost of the LCD panel.

Description

technical field [0001] The invention relates to a thin film removal method and its equipment, in particular to a method and equipment for removing thin films by using plasma in an atmospheric state. Background technique [0002] The process of traditional liquid crystal panel (TFT-LCD) must be switched repeatedly between dry and wet. In order to speed up the process, panel manufacturers are trying their best to carry out each process of TFT-LCD in a dry environment, but the removal of photoresist still remains The panel must be soaked in a stripping solution. [0003] After the photoresist is removed by immersion, the panel must be air-dried, which will increase the process cost and delay the process. In order to meet the needs of large-size panels, the above shortcomings will be more serious as the size of the panel increases. In order to speed up the panel process, some manufacturers have begun to use plasma to remove photoresist. Plasma removal is a dry process, so the e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/42
Inventor 张加强吴清吉蔡陈德林春宏
Owner IND TECH RES INST