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RFID packaging structure

A packaging structure and substrate technology, which is applied to record carriers, instruments, and computer parts used in machines. It can solve problems such as the ability to block water vapor, and the overall structural strength of RFID transponders is poor, so as to increase the effect of blocking water vapor.

Inactive Publication Date: 2007-11-28
ZOWIE TECH CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, although the direct chip bonding method can reduce the manufacturing cost, when it is actually applied to the RFID transponder, it is found that in the RFID system, the success rate of the RFID reader receiving the data from the RFID transponder is only about 60%. % to about 70%, and the ability to block water vapor and the overall structural strength of the RFID transponder are poor

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Embodiment Construction

[0055] Please refer to FIG. 1A. FIG. 1A is a schematic diagram of the RFID packaging structure of the first embodiment of the present invention. The RFID packaging structure 1 of the first embodiment of the present invention includes a first substrate 10, an RFID crystal grain (die) 12, and a second The substrate 18 , at least one first circuit pattern 20 , 22 and an adhesive material 28 .

[0056] The material of the above-mentioned first substrate 10 and second substrate 18 can be a soft organic material or glass fiber material, such as a combination of polymer, polyester and other similar materials, or any combination of hard materials such as ceramics, The lower surface of the RFID chip 12 has at least one I / O pad (I / O pad) 14, 16, and the RFID chip 12 is disposed on the lower surface of the first substrate 10, and the first circuit patterns 20, 22 Formed on the upper surface of the second substrate 18, the first circuit patterns 20, 22 respectively have a first connection...

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Abstract

The invention discloses a RFID packaging structure for dissolving lack of the data reading rate caused by RFID responder structure of the known technique, which comprises the following steps: packaging the RFID crystal particle with veneered material by the packaging technique; providing a plurality of methods for the ability of reading the data by the packaging structure; taking the example of increasing a condenser component for providing RFID packaging structure fit for the different frequency by means of adjusting the size of the condenser component, or forming RFID packaging structure in order to reduce the cost with veneer structure matching the veneered material.

Description

technical field [0001] The invention is a package structure, especially a package structure for RFID. Background technique [0002] RFID is an advanced wireless identification technology. Through the microchip "label" on the product, the information can be connected to the computer network to identify, track and confirm the status of the product. [0003] RFID consists of two devices, a transponder (Transponder) and a reader (Reader). The transponder, such as a card or tag, is a passive reply device. When the system is activated, the reader generates a radio signal of a specific frequency, which stimulates the program in the transponder's internal chip, thereby generating radio frequency waves, and The identification code (ID Code) in the internal memory is sent back to the reader, and after being decoded, the main control computer performs identification to complete the identification function. [0004] Known RFID transponders are manufactured by direct chip attach proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
Inventor 钟宇鹏章国栋陈恩明李家伟
Owner ZOWIE TECH CORP