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Substrate processing device

A substrate processing device and substrate technology, applied in the direction of originals, optics, instruments, etc. for photomechanical processing, can solve problems such as damage to substrates, pollution, uneven heat treatment status, etc., and achieve the effect of preventing damage or pollution

Inactive Publication Date: 2008-01-09
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the conventional substrate processing apparatus, since the support pins partially contact the lower surface of the substrate, the support pins may contaminate or damage the lower surface of the substrate.
In addition, in the conventional substrate processing apparatus, since the substrate is heat-treated in a state where the support pins are partially in contact with the lower surface of the substrate, the state of the heat treatment may be uneven within the surface of the substrate.

Method used

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no. 1 approach

[0055] 1 is a plan view showing the structure of a substrate processing apparatus 1 according to a first embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of the substrate processing apparatus 1 in FIG. 1 taken along line II-II. FIG. 2 also shows the configuration of the supply and exhaust system for the substrate processing apparatus 1 . In addition, in FIGS. 1 and 2 and the following figures, in order to clearly show the positional relationship of each part, an xyz rectangular coordinate system is indicated.

[0056] This substrate processing apparatus 1 is an apparatus for heat-processing a substrate 90 in a photolithography process of selectively etching the surface of a rectangular glass substrate (hereinafter simply referred to as "substrate") 90 for a liquid crystal display device. As shown in FIGS. 1 and 2 , the substrate processing apparatus 1 mainly includes a chamber 11 , a substrate holding plate 12 , and a substrate transfer mechanis...

no. 2 approach

[0073] 8 is a plan view showing the structure of a substrate processing apparatus 2 according to a second embodiment of the present invention, and FIG. 9 is a longitudinal sectional view of the substrate processing apparatus 2 in FIG. 8 taken along line IX-IX. This substrate processing apparatus 2 has the same structure as that of the substrate processing apparatus 1 of the first embodiment except for the spray holes and the suction holes formed on the substrate holding plate 12. Therefore, in FIG. 8 and FIG. Common parts of the substrate processing apparatus 1 according to one embodiment are denoted by the same reference numerals as those in FIGS. 1 and 2 , and repeated descriptions will be omitted below.

[0074] In the substrate holding plate 12 of the substrate processing apparatus 2, a plurality of nozzle holes 22a for blowing nitrogen gas upward and a plurality of suction holes 22b for sucking the gas on the upper part of the plate are formed. The plurality of injection ...

no. 3 approach

[0090] FIG. 15 is a plan view showing the structure of a substrate processing apparatus 3 according to a third embodiment of the present invention. This substrate processing apparatus 3 is an apparatus for performing resist coating processing, heating processing, and cooling processing on the substrate 90 in the photolithography process of selectively etching the surface of the substrate 90 . The substrate processing apparatus 3 mainly includes a resist coating processing unit 4 , a plurality of heat processing units 5 to 9 , and a substrate transfer mechanism 31 .

[0091] FIG. 16 is a longitudinal sectional view of the resist coating processing unit 4 . First, the configuration of the resist coating processing unit 4 will be described with reference to FIGS. 15 and 16 . The resist coating processing section 4 is a processing section for applying a resist liquid on the upper surface of the substrate 90 to form a resist film. As shown in FIGS. 15 and 16 , the resist coating p...

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PUM

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Abstract

The invention provides a substrate processing device, which can prevent the undersurface of a substrate from being polluted and damaged and uniformly perform heat treatment of the substrate. The substrate processing device (1) holds a substrate (90) on substrate holding plate (12) by non-contact and makes the substrate (90) move along a direction and perform heat treatment. Thus, a carrier pin is unlikely to join with the undersurface of the substrate (90), in order to prevent the substrate from being polluted and damaged. In addition, the carrier pin will not make the local part of heat treatment uneven. Moreover, because of delivering the substrate (90) and synchronously performing heat treatment, no matter how is the air flow of undersurface side of the substrate (90), the heat treatment can be evenly performed in the substrate (90).

Description

technical field [0001] The present invention relates to a substrate processing apparatus for heat-treating substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, and the like, and glass substrates for PDPs. Background technique [0002] Conventionally, in the manufacturing process of the substrate, a process of applying a resist solution to the surface of the substrate is first performed, and then heat treatment (heating treatment or cooling treatment) is performed to improve the adhesion between the substrate surface and the resist . A conventional substrate processing apparatus that performs heat treatment places a substrate on a substrate holding plate disposed in a chamber, and heats or cools the substrate. [0003] As shown in FIG. 20 , a conventional substrate processing apparatus 100 has a structure in which a plurality of support pins 102 such as proximity pins are provided on a substrate holding plate 101, a substrate 109 is p...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/67H01L21/683H01L21/027H01L21/30G03F7/38
CPCG03F1/60G03F7/202H01L21/0274
Inventor 柿村崇
Owner DAINIPPON SCREEN MTG CO LTD