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Peltier low temperature differential heat analyzer

An analyzer and micro-thermal technology, applied in the field of thermal analysis and testing, can solve the problems of high equipment cost, long control cycle, difficult control, etc., and achieve the effect of low cost, compact structure and fast response

Inactive Publication Date: 2008-01-23
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional methods used for thermal analysis measurement include liquid nitrogen or compression refrigeration. These methods have long control cycles, serious hysteresis, difficult control, and high equipment costs.

Method used

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  • Peltier low temperature differential heat analyzer

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Embodiment 1

[0018] As shown in Figure 1. Connect the following components as shown in Figure 1, and those skilled in the art can implement it smoothly. This device is composed of sensor 3, crystallizer 2, chip 4, heat pump 11 and temperature / heat flow measurement and power control device 7 connected in sequence. Sensor 1 adopts Pt100 probe type platinum thermal resistance, and crystallizer adopts 35*18*25mm metal crystal Sensor 3 adopts Pt100 thin-plate platinum thermal resistance, chip 4 adopts TEC1-12704T125 semiconductor cooling chip, sealing device 5 adopts 100*100*102mm metal sealing groove, temperature / heat flow measuring device 6 adopts XMTH-7000 intelligent digital display adjustment Instrument, temperature / heat flow measurement and power control device 7 adopts TCA-808 program controller, modulus A / D conversion device 8 adopts ADAM-4015 module, computer 9 adopts P4 processor PC, printer 10 adopts Lenovo 7000 printer, heat pump 11 adopts Jiuzhou Fengshen CPU water-cooled cooling ...

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PUM

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Abstract

The invention pertains to the technical field of thermal analysis and test, in particular to a Peltire low-temperature micro thermal analyzer, which comprises sensors, crystallizer, a hot pump chip, a sealer, a temperature / heat flow measuring device, a temperature / heat flow measuring and power controller, an A / D converter, and a digital processor, etc. The sealer is hollow in the middle, the sensor, crystallizer and the chip are in the sealer, the chip is located at the bottom of the sealer, the crystallizer is above the chip; the top of the crystallizer is provided with a recess, in which a sensor is placed; at one side of the crystallizer, a sensor is provided, which is connected with a wire with the temperature / heat flow measuring and power controller, and is connected with a wire with the temperature / heat flow measuring device; another end of the temperature / heat flow measuring device is connected with the A / D converter, which is connected with a computer that is connected with a printer. The invention is of high measuring accuracy, is highly automatic, can be used for studying the nucleation principle of crystal of organic system such as DNA, protein, polymers and medicines, etc., for studying solid-liquid phase balancing and crystallizing principle, etc.

Description

technical field [0001] The invention belongs to the technical field of thermal analysis and testing, and in particular relates to a Peltier low-temperature micro-thermal analyzer. Background technique [0002] The Peltire effect is that when current flows through the interface of two different conductors, heat will be absorbed from the outside world, or heat will be released to the outside world. The semiconductor heat pump chip is based on this effect. When an N-type semiconductor (electronic type) and a P-type semiconductor (hole type) are connected to form a galvanic pair and the power is turned on, energy transfer can occur. N-type and P-type semiconductors generate electrons and holes respectively. The current flowing from the N-type element to the joint of the P-type element absorbs heat called the cold end, and the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end. The characteristic of the semiconductor h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/00
Inventor 黄民郭思斯郭艳姿李佟茗
Owner TONGJI UNIV
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