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Liquid processing system

A liquid treatment and treatment liquid technology, which is applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve the problems of enlarged piping space, complicated piping arrangement, and difficulty in uniform treatment.

Active Publication Date: 2008-01-30
TOKYO ELECTRON LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, when a plurality of processing units are stacked as described above, when the piping that circulates and supplies the processing liquid detours, up and down fluctuations will occur.
Therefore, the installation of the piping becomes complicated, and the space occupied by the piping becomes larger
In addition, since the distance from the processing unit to the collective exhaust gas / collective drain differs for each processing unit, it may be difficult to perform uniform processing.

Method used

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Embodiment Construction

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in the following description, the same reference numerals are assigned to components having substantially the same functions and configurations, and descriptions are repeated only when necessary. Here, a case where the present invention is applied to a liquid processing system for cleaning the front and back of a semiconductor wafer (hereinafter simply referred to as wafer) will be described as an example.

[0019] FIG. 1 is a plan view showing a schematic configuration of a liquid processing system according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the front side along line II-II of FIG. 1 . Fig. 3 is a side cross-sectional view along line III-III of Fig. 1 .

[0020] The liquid processing system 100 includes an input / output station (substrate input / output unit) 1 and a processing station (liquid processing unit) 2 that ar...

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Abstract

A liquid processing system includes a liquid processing section including liquid processing units horizontally disposed therein and each configured to perform a liquid process while supplying a process liquid onto a substrate; a process liquid storing section that stores the process liquid to be supplied to the liquid processing units of the liquid processing section; and a piping unit including a supply pipe configured to guide the process liquid from the process liquid storing section to the liquid processing units. The process liquid storing section, the piping unit, and the liquid processing section are disposed inside a common casing in this order from below. The supply pipe of the piping unit has a horizontal pipe portion horizontally extending along an array direction of the liquid processing units, such that the process liquid is supplied from the horizontal pipe portion to the liquid processing units individually.

Description

technical field [0001] The present invention relates to a liquid processing system for performing predetermined liquid processing, such as cleaning processing, on substrates such as semiconductor wafers. Background technique [0002] In the manufacturing process of semiconductor devices and the manufacturing process of flat panel displays (FPDs), a process of supplying a processing liquid to a semiconductor wafer or a glass substrate as a substrate to be processed to perform liquid processing is often used. Such a process includes, for example, cleaning treatment for removing particles and dirt adhering to the substrate, application treatment of a photoresist solution and a developer solution in a photolithography process, and the like. [0003] As such a liquid processing system, a system including a plurality of sheet-type processing units and a transport device for inputting and outputting to these processing units is used. Each processing unit holds a substrate such as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/67H01L21/30H01L21/306
CPCH01L21/67051H01L21/67173H01L21/6708H01L21/67017H01L21/08H01L21/304
Inventor 松本和久金子聪饱本正己户岛孝之伊藤规宏
Owner TOKYO ELECTRON LTD
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