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Image sensing device packaging digital camera module group using the same

A technology for image sensors and digital cameras, which is applied in image communication, electric solid-state devices, semiconductor devices, etc., can solve the problems of displacement or peeling of the cover body 87, and low product reliability, so as to reduce peeling or offset Possibility, image quality improvement, pollution reduction effect

Inactive Publication Date: 2008-01-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, the first adhesive 86 will release a large amount of volatile gas during the baking process, causing internal pressure in the groove 83, so the cover 87 is easy to shift or peel off during use, resulting in low reliability of the product

Method used

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  • Image sensing device packaging digital camera module group using the same
  • Image sensing device packaging digital camera module group using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] Please refer to a preferred embodiment of the digital camera module of the present invention shown in Figure 1, the digital camera module 10 includes an image sensor package 20, a second adhesive 40, a lens module 50 and a mirror holder 60, wherein, the lens module 50 is arranged in the mirror holder 60, the mirror holder 60 is fixed on the image sensor package 20 through the second adhesive 40, and the image sensor package 20 is in the optical path of the lens module 50 middle.

[0015] The image sensor package 20 includes a carrier 21 , a chip 23 , a plurality of wires 24 , a support 25 , a first adhesive 26 and a cover 28 .

[0016] The carrier 21 is flat and has a top surface (not shown in the figure) and a bottom surface (not shown in the figure). The carrier 21 includes a plurality of upper solder pads 215 disposed on the top surface, and a plurality of lower solder pads 216 disposed on the bottom surface. The lower pad 216 is electrically connected to the upper...

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PUM

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Abstract

An image sensor package with a module group of digital camera applying in the image sensor package comprises a carrier, a wafer, a plurality of conductors, a first adhesion matter and a cover, which is characterized in that the carrier is plate-shaped and has a top surface which is provided with a plurality of welding pads, and the wafer, which is fixed to the top surface of the carrier, is provided with a sensing area and a plurality of welding pads of the wafer, the conductors are electrically connected with the welding pads of the wafer and the upper welding pad of the carrier, the first adhesion matter is arranged on the top surface of wafer and surrounds the lateral side of the sensing area of wafer, through the first adhesion matter, the cover is fixed to the wafer and closes the sensing area of the wafer. The module group of digital camera comprises the image sensor package and a lens module group in optical path of which is provided with the image sensor package.

Description

technical field [0001] The present invention relates to an image sensor package and a digital camera module for its application, in particular to an image sensor package with high imaging quality and high product reliability and a digital camera module for its application. Background technique [0002] At present, mobile phones are developing toward multifunctional trends, and mobile phones with camera functions are very popular once they are released. A digital camera module used in a mobile phone not only needs to have better photographic performance, but also needs to meet the requirements of thinness, lightness and small size to match the development trend of mobile phones. The size and performance of the image sensor package used to acquire images in the digital camera module is an important factor determining the size and photographic performance of the digital camera module. [0003] Please refer to Fig. 2, a kind of known digital camera module 80 comprises a substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/10H04N5/225
CPCH01L2224/8592H01L2224/48091H01L27/14618H01L2924/00014
Inventor 吴志成杨昌国
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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