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Method for preparing line-type o-cresol novolac epoxy resin

A phenolic epoxy resin, phenolic resin technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of difficult implementation, high cost, expensive equipment, etc.

Inactive Publication Date: 2008-02-13
CHINA PETROCHEMICAL CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Japanese patent JP6060123 adopts the method of firstly copolymerizing phenols and formaldehyde into a linear resin containing allyl etherification structural units, and finally oxidizing the double bond into an epoxy group with peracetic acid at low temperature to prepare a linear o-cresol novolac epoxy resin. method, this method has high cost, expensive equipment, and is not easy to implement

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Example 1: 100 g of o-cresol novolac resin (Mn=250), 460 g of epichlorohydrin, and 5 g of the polar auxiliary agent pentaerythritol were added to the reactor; at a reaction temperature of 55° C., reflux under reduced pressure for 2 hours, The total amount of basic catalyst added dropwise is 50% NaOH, 40g; after recovering epichlorohydrin under reduced pressure, dissolve 100g of cyclohexanone as a solvent, and add basic catalyst 50% NaHCO 3 , 40g, refined at a temperature of 60°C for 1 hour, washed with water to Ph6-7, and recovered the solvent under reduced pressure to obtain o-cresol novolac epoxy resin. The product results are shown in Table 2.

Embodiment 2～6

[0012] Embodiments 2 to 6: The operation steps are the same as in Embodiment 1, and the reaction conditions and product results are shown in Table 1 and Table 2 respectively.

[0013] Table 1: Reaction Conditions

[0014] serial number

1#

2#

3#

4#

5#

6#

o-cresol

fat

100g

Mn=250

100g

Mn=754

100g

Mn=476

100g

Mn=1500

100g

Mn=958

100g

Mn=1240

Epichlorohydrin

460g

770g

1200g

300g

1080g

800g

[0015]

polar additive

pentaerythritol

2g

Dimethylmethylene

Sulfone 10g

1,4-Dioxygen

Hexacyclic 15g

Isopropanol 20g

tert-butanol 10g

1,4-Dioxygen

Hexacyclic 10g

basic catalyst

50%

NaOH

40g

50% KOH

50g

60%

Na 2 CO 3

133g

60%

NaHCO 3 ...

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PUM

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Abstract

The invention provides a preparation method of the linear o-cresol-formaldehyde epoxy resin with the o-cresol-formaldehyde resin and epichlorohydrin as the raw materials; the polar additive is added; at the temperature between 40 and 120 Celsius system, the alkali catalyst is dropped; the material is decompressed, returned and reacted for 2 to 10 hours; the epichlorohydrin is decompressed and recycled; the solvent is added to dissolve and the alkali catalyst; the material is refined for 0.5 to 10 hours at the temperature between 40 and 100 Celsius system; the water is added until the Ph value is between 6 and 7; the solvent is decompressed and recycled; then the o-cresol-formaldehyde epoxy resin can be made. For the linear o-cresol-formaldehyde epoxy resin produced in the method, the epoxy value is above 0.50 eq per 100g; the content of the chlorine ion is below 150 ppm; the electronic components packaged with the resin can maintain the good electrical insulating properties even in the high-temperature, humid harsh environment.

Description

technical field [0001] The invention relates to a preparation method of linear o-cresol novolac epoxy resin. Background technique [0002] In the electronics industry, packaging is one of the necessary processes for electronic components. The packaged semiconductor components can avoid the intrusion of moisture, dust and harmful gases. It can also slow down vibration, prevent external force damage, and stabilize component parameters. important role in the electronics industry. The epoxy molding compound used for packaging is obtained by compounding novolac epoxy resin with filler, curing agent, toughening agent, etc. At present, 90% of industrial and civilian large-scale integrated circuits are packaged with epoxy molding compound. Novolac epoxy resin is the core component of molding compounds, and its performance directly affects the performance of molding compounds. In addition to requiring fast curing, low stress, good heat resistance and moisture resistance, it also re...

Claims

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Application Information

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IPC IPC(8): C08G59/08H01L23/29
Inventor 张晖王新龙喻林吴际伟
Owner CHINA PETROCHEMICAL CORP
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