Hot press device and hot press method using the same
A heat and control unit technology, which is applied in the direction of electric heating devices, auxiliary devices, printed circuits assembled with electric components, etc., can solve problems such as uneven temperature on the pressing surface, and achieve the effect of avoiding uneven temperature and improving the quality of pressing
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[0020] Please refer to FIGS. 3 and 4 together. FIG. 3 is a three-dimensional schematic diagram of a thermal compression device disclosed in a preferred embodiment of the present invention, and FIG. 4 is a schematic plan view of another working state of the thermal compression device according to the present invention. The thermocompression bonding device 2 is used to connect two electronic components 31, 32 to be bonded by solder 33, and includes a base 21, an XY machine 22, an infrared temperature sensor 23, and a thermocompression contact. 24. A lifting mechanism 25, a movable platform 26, a horizontal frame 27 and a control unit 28.
[0021] The X-Y machine platform 22 is arranged on the base platform 21 to play a supporting role, and it can move in the X direction and the Y direction perpendicular to each other in the horizontal plane.
[0022] The infrared temperature sensor 23 is an instrument for sensing temperature and converting the sensed temperature signal into an elect...
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