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Hot press device and hot press method using the same

A heat and control unit technology, which is applied in the direction of electric heating devices, auxiliary devices, printed circuits assembled with electric components, etc., can solve problems such as uneven temperature on the pressing surface, and achieve the effect of avoiding uneven temperature and improving the quality of pressing

Inactive Publication Date: 2008-02-20
INNOCOM TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the problem of uneven temperature of the pressing surface in the prior art, it is necessary to provide a thermal pressing device that improves the temperature uniformity of the pressing surface

Method used

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  • Hot press device and hot press method using the same
  • Hot press device and hot press method using the same
  • Hot press device and hot press method using the same

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Experimental program
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Embodiment Construction

[0020] Please refer to FIG. 3 and FIG. 4 together. FIG. 3 is a schematic perspective view of a thermocompression bonding device disclosed in a preferred embodiment of the present invention, and FIG. 4 is a plan view of a working state of the thermocompression bonding device from another angle of the present invention. The thermocompression bonding device 2 is used to bond two electronic components 31, 32 to be bonded by solder 33, and includes a base 21, an X-Y machine 22, an infrared temperature sensor 23, and a thermocompression contact 24. A lifting mechanism 25, a movable table 26, a horizontal frame 27 and a control unit 28.

[0021] The X-Y machine table 22 is set on the base 21 to play a supporting role, and it can move along the X direction and the Y direction perpendicular to each other in the horizontal plane.

[0022] The infrared temperature sensor 23 is used to sense temperature and convert the sensed temperature signal into an electrical signal. It is arranged in...

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Abstract

The present invention relates to a hot-pressing device used for electrically and mechanically connecting for the two electronic components waiting for pressing and a hot-pressing method by adopting the hot-pressing device. The hot-pressing device comprises a control unit and a hot-pressing contract electrically connected with thereof, wherein, the hot-pressing contract comprises a plurality of heating noumena, and the control unit respectively controls each heating noumenon to work. The hot-pressing device ensures the even temperature on the surface of the pressing position of the electronic components waiting for pressing by controlling the working of a plurality of heating noumena by the control unit, and avoids that: the disproportionation of heat transmission and releasing causes the temperature uneven in the pressing position, thereby causing the impact to pressing quality.

Description

technical field [0001] The invention relates to a thermocompression bonding device and a thermocompression bonding method using the device. Background technique [0002] With the development of the electronics industry, the welding and pressing technology between electronic components has been more and more widely used. How to ensure the precise electrical connectivity, mechanical stretch resistance and flatness of the pressing surface between the electronic components after pressing, etc. Reliable indicators are gaining more and more attention from the industry. For example, in the assembly process of liquid crystal display modules, including the bonding of components such as liquid crystal display panels, driver integrated circuits, flexible circuit boards, and printed circuit boards, the above-mentioned lamination process usually uses a thermal lamination device to bond the anisotropic conductive The agent is set as solder between two electronic components to be pressed,...

Claims

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Application Information

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IPC IPC(8): B23K3/04B23K3/08B23K20/00H05K3/34
Inventor 陈益莹
Owner INNOCOM TECH SHENZHEN
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