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Tin paste and its use in thermal press welding method

A hot-pressing welding and solder paste technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as solder short circuit, prevent the reduction of the thickness of the tin layer, reduce the fluidity of the solder paste, and avoid short circuits effect of the phenomenon

Inactive Publication Date: 2008-02-20
黄柏山
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the electronic parts are soldered to the circuit board, often due to the proximity between the pads of the electronic parts, the solder overflowing between the pads is connected to each other and the short circuit phenomenon is more prominent.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 2 approach

[0022] The second embodiment of the present invention is a thermocompression welding method, which comprises the following steps:

[0023] Step 1: provide a heat press device, the heat press device can be a constant temperature heat press or a pulse heat press, the heat press has two carriers, a pressure head and a cooling device;

[0024] Step 2: Provide two pre-heated and press-welded workpieces, respectively set the two workpieces on the two carriers of the hot-pressing device and perform relative positioning;

[0025] Step 3: Coating solder paste on the welding interface of the workpiece, and setting at least one support within the pressing range of the pressure head of the heat press, wherein the solder paste includes tin powder and flux, preferably, the The support can be pre-mixed in solder paste and flux in a certain proportion. The support is a strip or a solid particle, such as glass balls, metal balls, engineering plastic balls and the like. The temperature of the...

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PUM

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Abstract

The present invention relates to a tin ointment, which comprises a tin powder, a scaling powder and a supporting body, and the supporting body is positioned in the tin powder and the scaling powder. The tin ointment or hot pressure welding manner of the present invention can be used for the welding connecting of FPC and the tin of FPC, or the welding connecting of the FPC and the tin of the PCB, and by using the tin ointment mixed with the supporting body, the present invention can hold the connecting for the components and the PCB in a pressing welding manner.

Description

technical field [0001] The present invention relates to a structure of solder paste and a method of using the solder paste for thermocompression welding, and in particular relates to a solder paste with a support and a method of using the solder paste for thermocompression welding. Background technique [0002] With the advent of the information age, the information age is leading us to the cutting edge of technological fashion. At the same time, with the rapid development of communication products, the rise of consumer electronics products has been driven, and the global sales of personal computers, personal communication systems, digital electronic communications and other products have increased year by year. Therefore, the integration of different electronic components on the circuit board is more important for the manufactured electronic products. Moreover, since portable information electronic products and mobile communication products are developing towards thinner, ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/02B23K1/00
CPCB23K35/262H05K2201/2036H05K3/363H05K3/3484H05K2201/0212H05K2201/0215H05K2201/0209H05K2203/0278H05K3/3485
Inventor 黄柏山
Owner 黄柏山