Substrate treatment apparatus and substrate treatment method

A substrate processing device and substrate technology, which are applied in chemical instruments and methods, cleaning methods and utensils, and cleaning methods using liquids, etc., can solve the problems of substrate contamination, crystallization, and particle formation.

Inactive Publication Date: 2008-03-05
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the chemical solution is sprayed from the nozzle to the rotating substrate, the chemical solution splashes around the substrate, and the splashed chemical solution adheres to the components arranged around the spin chuck, and may crystallize after drying.
The crystallization of such liquid medicine will become particles, which will contaminate the substrate

Method used

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  • Substrate treatment apparatus and substrate treatment method

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Embodiment Construction

[0014] FIG. 1 is a schematic cross-sectional view showing the structure of a substrate processing apparatus according to an embodiment of the present invention.

[0015] The substrate processing apparatus 1 is a single-sheet type apparatus that performs processing with a processing liquid on the surface (upper surface) on the device forming region side of a semiconductor wafer (hereinafter referred to as "wafer") W as an example of a substrate. The substrate processing apparatus 1 includes a spin chuck 10 for rotating a wafer W held substantially horizontally, and a push-pull plate 2 for treating the surface of the wafer W held on the spin chuck 10 with a processing liquid. In addition, chemical liquid and pure water are used as the processing liquid for processing the surface of the wafer W.

[0016] The spin chuck 10 is, for example, a vacuum suction type chuck. Further, the spin chuck 10 has a rotating shaft 11 extending substantially vertically and a suction pad 12 mounte...

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PUM

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Abstract

A substrate treatment apparatus according to the present invention includes: a substrate holding unit which holds a substrate; a push-pull plate to be positioned in spaced opposed relation to one surface of the substrate held by the substrate holding unit, the push-pull plate having a plurality of outlet ports which discharge a treatment liquid and a plurality of suction ports which suck the treatment liquid discharged from the outlet ports, the outlet ports and the suction ports being provided in a surface of the push-pull plate to be opposed to the one surface of the substrate; and a relative rotation unit which rotates the substrate held by the substrate holding unit and the push-pull plate relative to each other.

Description

technical field [0001] The invention relates to a substrate processing method and a substrate processing device suitable for processing a substrate with a processing liquid. The substrates to be processed include, for example, semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for plasma display devices, glass substrates for FED (field emission displays), substrates for optical disks, substrates for magnetic disks, and magneto-optical disks. Substrates, glass substrates for photomasks, ceramic substrates, etc. Background technique [0002] In the manufacturing process of a semiconductor device or a liquid crystal display device, a chemical solution is supplied to the surface of a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display panel, and the surface of the substrate is cleaned with the chemical solution. [0003] For example, an apparatus that performs a single-sheet cleaning process that pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/02H01L21/302H01L21/306H01L21/67B08B3/00G02F1/1333H01J9/00G11B7/26G11B5/84G03F1/00B08B3/02G03F1/82H01L21/304
CPCH01L21/67051H01L21/304H01L21/683
Inventor 内田博章
Owner DAINIPPON SCREEN MTG CO LTD
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