Apparatus for treating gas

Abstract

Provided is an apparatus for treating a gas by using a packing material, for example, a gas treatment apparatus for converting an exhaust gas containing harmful substances, for example, various semiconductor material gases used in a semiconductor manufacturing process, a liquid crystal display element manufacturing process or the like, such as silane, phosphine, hydrogen chloride, dichlorosilane and ammonia, to a harmless gas by using a detoxifying agent. An apparatus for treating a gas, which comprises a detoxifying agent layer (3) provided in a flow path (6) in a gas treatment cylinder (1) and circular baffle boards (7) being provided in such a manner that they contact respectively with the upstream side face and the downstream side face of the detoxifying agent layer (3) and that the peripheries thereof contact with the surface of the wall of the flow path (6), wherein it is preferred that the width of the circular baffle board (7) is five times the outer diameter of the packing material or more and 9 % of the inner diameter (D) of the gas treatment cylinder (1) or less when an outer diameter (di) of the packing material and an inner diameter (D) of the gas treatment cylinder (1) has a relationship of 5di = 0.09D, and the above width is 2 to 9 % of the inner diameter of the gas treatment cylinder (1) when the above relationship is 5di > 0.09D.

Description

technical field [0001] The present invention relates to a gas treatment device using a filler, for example, a gas treatment device for detoxifying waste gas containing harmful substances such as semiconductor manufacturing processes and liquid crystal display element manufacturing processes using a detoxifying agent Various semiconductor material gases such as silane, phosphine, hydrogen chloride, dichlorosilane and ammonia. Background technique [0002] When removing a specific component contained in a gas, a method of removing the component from the gas by passing the gas through a device filled with a filler or the like, thereby allowing the component to interact with the filler A filler that has an affinity for an ingredient or a filler that chemically reacts with that ingredient. [0003] This is the case, for example, with the detoxification of waste gases generated in various semiconductor manufacturing processes. Exhaust gas from equipment using semiconductor mater...

AI Technical Summary

Problems solved by technology

However, when the above-mentioned lamination method is applied to an exhaust gas treatment device, it is necessary to keep the state that the board is closely attached to the inner wall for a long time in an environment where the temperature rises irregularly due to the reaction.

Therefore, it is difficult to apply this method to exhaust gas treatment equipment of semiconductor manufacturing equipment in terms of safety and cost

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