Making method for semiconductor encapsulation component and semiconductor part location structure and method

Abstract

This invention relates to a manufacturing method for semiconductor package pieces and a locating structure and a method for semiconductor elements, which provides a base board and a loader for locating said board, in which, the length and width of the board approach to the pre-desinged size of the package piece, a chip is set on the board, an aperture is set on the loader and the size of which is greater than that of the board and at least one storage hole is set around the aperture to hold the board in the aperture, at the same time, glue is filled into the storage hole then to fill the gap between the board and the loader by capillarity and form a package colloid covering said chip then to demold and cut along the edge of the base board according to the pre-designed size of the package piece after the covering area of the colloid is greater than that of the aperture so as to manufacture a semiconductor package piece.

Description

technical field [0001] The invention relates to a semiconductor manufacturing method, in particular to a semiconductor package manufacturing method and a semiconductor element positioning structure and method. Background technique [0002] A molded flip-chip ball grid array (Molded Flip-Chip Ball Grid Array, Molded FCBGA) semiconductor package is shown in FIG. The chip 11, and the plurality of solder balls 12 planted on the lower surface of the substrate 10 to electrically connect to the outside world, and at the same time, the package also includes a molding method formed on the upper surface of the substrate 10 and covering the chip 11 The encapsulation colloid 13. Related prior art such as US Patent No. 6,038,136, No. 6,444,498, No. 6,699,731 or Taiwan Patent Publication No. 559960 have disclosed similar packaging structures. [0003] Regarding the manufacturing method of the molded flip-chip ball grid array semiconductor package, as disclosed in Taiwan Patent Publicati...

AI Technical Summary

Problems solved by technology

[0007] However, in the aforementioned manufacturing method, in order to effectively position the substrate 20 and cover the gap 27, it is disclosed that the gap 27 between the substrate 20 and the carrier 26 is filled with, for example, solder mask (Solder Mask) or The glue 28 of polymer materials such as epoxy resin can speed up the dispensing operation. Usually, the gap 27 needs to be reserved at least 1mm, so that the dispensing operation can be quickly filled in the gap 27 by writing (pen-write). Adhesive material 28, but the larger the gap 27, the more the amount of rubber material 28 required, resulting in an increase in cost; at the same time, if the gap 27 is too large, it is easy to cause the substrate 20 that is pre-bonded on the adhesive tape to shift. It even causes troubles in the subsequent manufacturing method. For example, due to the deviation of the substrate 20, the gaps between the two opposite sides are different, which leads to insufficient filling of the glue on one side, while the glue overflow problem occurs on the other side (as shown in FIG. 4A ), even corresponding to the occurrence of overflow. On one side of the glue, when the encapsulant 23 covering the chip 21 is subsequently formed, the glue 28 (as shown in FIG. 4B ) will remain between the encapsulant 23 and the substrate 20, and the edge delamination problem will easily occur.

Relatively, if the gap 27 is too small, although the problem of substrate 20 offset can be reduced, a thinner dispensing needle and a slower dispensing speed must be used to fully fill the gap 27 with the glue 28 , but this will cause the dispensing speed to be too slow, and at the same time lead to an increase in the cost of the manufacturing method

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