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Method for preparing ceramic sheet

A manufacturing method and technology of ceramic thin plates, applied in the direction of manufacturing tools, ceramic molding machines, ceramic layered products, etc., can solve the distortion and warping of ceramic thin plates 11, which is not suitable for mass production of tunnel kilns, and affects low-temperature co-fired ceramics Substrate 1 yield and reliability issues, to achieve good densification effect

Inactive Publication Date: 2008-04-16
DELTA ELECTRONICS INC
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Problems solved by technology

[0004] However, due to the sintering manufacturing process, the shrinkage of the ceramic thin plates 11 between different layers may be different, or holes may be generated due to the volatilization of solvents or binders during sintering, which often leads to deformation problems such as shrinkage, twisting, and warping of the ceramic thin plates 11. This phenomenon It is more significant in the manufacture of thinner ceramic sheets, which affects the yield and reliability of low temperature co-fired ceramic substrate 1
In order to solve the above problems, the prior art utilizes mechanical force during press forming to limit the shrinkage direction of the ceramic sheet 11 and suppress warpage, but this method is only suitable for batch production and is not suitable for the mass production manufacturing process of tunnel kilns

Method used

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  • Method for preparing ceramic sheet

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Embodiment Construction

[0024] A method for manufacturing a thin ceramic plate according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.

[0025] Please refer to figure 2 and image 3 As shown, a method for manufacturing a thin ceramic plate according to a preferred embodiment of the present invention includes steps S1 to S3. Step S1 provides at least one first green sheet 31 and at least two second green sheets 32, the sintering temperature of the second green sheet 32 ​​is higher than the sintering temperature of the first green sheet 31; step S2 stacks the first green sheet 31 and the second green sheets 32 , so that the first green sheets 31 are sandwiched between the second green sheets 32 ; Step S3 is sintering at a sintering temperature of the first green sheets 31 . Because the sintering temperature is not higher than the sintering temperature of the s...

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Abstract

The invention discloses a method for manufacturing ceramic sheets. The method comprises the following steps that: at least one first blank sheet and at least two second blank sheets are provided, and the sintering temperature of the second blank sheets is higher than that of the first blank sheet; the first blank sheet and the second blank sheets are stacked to allow the first blank sheet to be placed among the second blank sheets; the first blank sheet is sintered into a ceramic sheet by the sintering temperature of the first blank sheet.

Description

technical field [0001] The invention relates to a method for manufacturing a ceramic thin plate, in particular to a method for manufacturing a flat and warp-free ceramic thin plate. Background technique [0002] In recent years, with the development of portable information electronic products and mobile communication products towards light, thin, multi-functional, high reliability and low price, high component density has become the development trend of electronic products. Source components and passive components are also developing in the direction of integration, chip and modularization, in order to effectively reduce the circuit size, thereby reducing costs and improving product competitiveness. [0003] The development of low temperature co-fired ceramics (Low Temperature Co-fired Ceramics, LTCC) technology has enabled the volume utilization of electronic products to be improved. It mainly integrates electronic components including passive components and active componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/64B32B18/00B28B3/00H05K1/11
Inventor 魏志宏谢俞枰
Owner DELTA ELECTRONICS INC
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