Method for identifying whether main reference plane position of silicon chip is correct or not
A main reference, surface position technology, applied in the direction of semiconductor/solid-state device testing/measurement, etc., can solve the problem of not finding, detecting and judging single crystal rods, single crystal rod reference plane manufacturing errors, etc.
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Embodiment 1
[0022] After the instrument is calibrated, place the 4-inch silicon wafer with the main reference surface facing up and stick it on the support, pull the X-ray switch, and turn the handwheel of the goniometer until the mA meter indicates the maximum value. At this time, the reading on the display is It is 24°40', it can be judged that the position of the main reference surface of the silicon wafer is correct.
Embodiment 2
[0024] After the instrument is calibrated, place the main reference surface of the 5-inch silicon wafer on the support, pull the X-ray switch, and turn the handwheel of the goniometer until the mA meter indicates the maximum value. At this time, the reading on the display is It is 24°28', it can be judged that the position of the main reference surface of the silicon wafer is correct.
Embodiment 3
[0026] After the instrument is calibrated, place the 6-inch silicon wafer with the main reference surface facing upwards and stick it on the support, turn off the X-ray switch, and turn the handwheel of the goniometer until the mA meter indicates the maximum value. At this time, the reading on the display is It is 24 ° 30', it can be judged that the position of the main reference surface of the silicon wafer is correct.
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