Universal bilateral composite mold integrated circuit pin forming mechanism of nesting structure

Abstract

The invention provides a molding mechanism for pins on integrated circuit of general bilateral compound die with a nest structure that has a left and right symmetric structures formed by two semi-die molding mechanisms; wherein, each semi-die molding mechanism contains a compound die base, a guide pillar, an upper die and a lower die; the lower die and the guide pillar are fixed on the compound die base; the upper die is fixed on an upper support and consists essentially of a shearing die, a bolt, a spring, an upper die fixing plate, a pressing plate and an upper forming die, while the lower die essentially consists of a support plate, a lower forming die, a support plate pressing plate, a support guide block and a lower die pressing plate. The invention realizes the regulation of molding height and length of the integrated circuit pins by regulating the relative positions of molding parts and finishes pin molding and shearing work procedure in one time, which ensures the molding precision and consistency of the integrated circuit to pin and meet connection requirement of the molding mechanism and automatic control system.

Description

technical field [0001] The invention relates to a forming mechanism for integrated circuit pins, in particular to a forming mechanism for universal bilateral composite mold integrated circuit pins with a nested structure. Background technique [0002] With the continuous advancement of science and technology, surface mount technology (SMT) is more and more widely used in aerospace research and production and other fields. The integrated circuit pin forming mechanism is a new type of mechanism developed based on SMT. It is used to process the straight pins of the integrated circuit into a pin shape that can be used for surface mounting. The integrated circuit before and after forming is shown in Figure 1. The molding quality of integrated circuit pins will directly affect the quality of surface mount products. It can be said that the molding of integrated circuit pins is not only a peripheral technology of SMT, but also an important part of it. [0003] The molding of integr...

AI Technical Summary

Problems solved by technology

However, most of the traditional general-purpose double-sided composite mold forming mechanisms are composed of simple bending and cutting mechanisms. There is no relationship between the bending and cutting mechanisms. The forming height and length of the integrated circuit pins are completed by adjusting the absolute position of the forming parts. , such a molding mechanism will produce large operating errors and cumulative errors, it is difficult to achieve the accuracy of molding processing and the consistency of molding pins, even under the same batch production conditions, it is impossible to have differences in the molding height and length of molding pins Avoided

Moreover, the absolute adjustment of the traditional general-purpose double-sided composite mold forming mechanism cannot meet the conditions for connecting the forming mechanism with the automatic control system

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