An improved electric cooling and heating component driven by semiconductor temperature difference

Abstract

The invention relates to an improved electric cooling and heating component which is induced by the temperature difference of a semiconductor, and the component comprises a conductive plate, a metal guide vane, a P-type mould, an N-type mould and a solder layer between the metal guide vane and the P-type mould and the N-type mould. The conductive plate is classified into the hot and cold end conductive plates. The invention is characterized in that the hot and cold end conductive plates which consist of plastic and the metal guide vane are respectively injected to be a mold or die-casted into an integral body. The metal guide vane extends out of the surfaces of the hot and cold end conductive plates. The hot and cold ends of the conductive plates are connected together to form a sealed space. The structure is adopted that the metal guide vane and the hot and cold ends of the conductive plates are respectively injected to be the mold or die-casted into the integral body, and compared with the prior art, the invention has the advantages of simple technology and decreased process. The metal guide vane is directly contacted with a hot and cold end radiator. The problem that the thermal conductivity of the ceramic is poor and the thermal efficiency is low in the prior art are overcome, thereby the invention has the advantages of simple technology, high rate of the finished product, extensive area of the thermal conductivity and excellent performance of the thermal conductivity.

Description

technical field [0001] The invention relates to a semiconductor thermoelectric cooling and heating assembly. Background technique [0002] In the current prior art, a semiconductor thermoelectric cooling and heating component includes a ceramic conduction plate, a metal baffle, a P-type galvanic couple, an N-type galvanic couple, and a connection between the metal baffle and the P-type galvanic couple and the N-type galvanic couple. Between the solder layer and the ceramic conduction plate are the cold and hot end ceramic conduction plates respectively. The space surrounded by the cold and hot end ceramic conduction plates is first sealed with masking paper and then coated with silica gel. The metal guide plate is attached by sintering On the ceramic conduction plate, the metal guide sheet is connected and fixed with the P-type galvanic couple and the N-type galvanic couple with solder to form a thermocouple. At present, only 40×40mm and 50×50mm ceramic conductive plates ca...

AI Technical Summary

Problems solved by technology

At present, only 40×40mm and 50×50mm ceramic conductive plates can be made, and the ceramic conductive plates that are too large are easy to break

Existing problems are: many processes, high cost, and the ceramic conductive plate is easy to break during the assembly process, which is difficult and low yield

Poor thermal conductivity due to thermal insulation of ceramics

Images