Nano-level ultra-high heat-conducting titanium-carbon composite material and preparation method thereof

Abstract

The invention discloses nano-titanium carbon composite material with ultra-high thermal conductivity, which is characterized in that: the invention has the components by weight percentage: 40 - 85 percent of acidized expansive graphite, 5 - 40 percent of flake graphite nano power, 5 - 30 percent of mesophase nano carbon power and 5 - 30 percent of metal titanium nano powder. The production process is that: the four components are weighted and mixed under temperature of 300 to 500 DEG C in a high-temperature reaction furnace for 2 - 5 hours so as to obtain concentrated mixture solution used for making carbon at high temperature; the concentrated mixture experiences molding, rolling or ejaculating under pressure of 120 - 300MPa and at temperature of 300 - 500 DEG C, so as to form; then the formed material is carbonized under temperature 900 - 1000 DEG C for 1 - 12 hours, and graphitized under temperature of 2500 to 3000 DEG C for 1 - 12 hours. The invention has simple technique and low production cost; the thermal conductivity of the invention can be lifted to above 700W / mK.

Description

technical field [0001] The invention relates to a heat exchange material, in particular to a nanoscale ultra-high thermal conductivity titanium-carbon composite material and a manufacturing method thereof. Background technique [0002] With the development of more and more electronic equipment, including some electronic equipment that can increase processing speed and frequency, have smaller size and more complex power requirements, and display other technical advantages, such as electronic and electrical components and other devices such as high Microprocessors and integrated circuits in power optics can generate relatively high temperatures. However, microprocessors, integrated circuits, and other complex electronic components typically only operate efficiently within a certain temperature range, and the heat generated during the operation of these devices can not only impair their performance, but can also degrade overall system performance and reliability, and can even ...

AI Technical Summary

Problems solved by technology

[0007] At present, the representative of heat dissipation materials higher than the thermal conductivity of copper (380W / mK) and aluminum (240W / mK) is diamond, which has a thermal conductivity of up to 2000W / mK, but diamonds are expensive and difficult to obtain. The most important issue is to replace copper and aluminum. Therefore, how to increase the thermal conductivity, facilitate production and reduce costs to meet the needs of different thermal management systems has become an urgent issue to be solved.