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Method for preparing electronic product shell

A technology for electronic products and casings, which is applied in the field of preparation of electronic product casings, can solve problems such as poor decorative effect and inability of casings to transmit light.

Inactive Publication Date: 2008-06-18
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a method for preparing an electronic product casing, which can obtain light transmission and a good decorative effect, in order to overcome the shortcomings of the existing electronic product casing preparation method that the casing cannot be transparent and the decorative effect is not good. electronic product casing

Method used

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  • Method for preparing electronic product shell

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preparation example Construction

[0009] The preparation method of the electronic product casing provided by the present invention includes forming a tin coating on the base material, wherein the method for forming the tin coating on the base material is a DC magnetron sputtering coating method, and the DC magnetron sputtering method includes Next, apply voltage on the magnetron target to sputter and deposit the target substance of the magnetron target on the base material, the target substance is tin, and the sputtering conditions make the thickness of the tin coating not greater than 100 nanometers.

[0010] The sputtering conditions are as long as the thickness of the tin coating is not greater than 100 nanometers. For example, the sputtering conditions include a pressure of 0.1-1.0 Pa, preferably 0.3-0.8 Pa, and a temperature of 20-300 °C, preferably 50-100 °C. °C; the sputtering time is 20-180 seconds, preferably 40-100 seconds. The sputtering conditions make the thickness of the tin coating preferably 20...

Embodiment 1

[0022] This embodiment is used to illustrate the preparation method of the housing of the electronic product provided by the present invention.

[0023] Using magnetron sputtering equipment (DC magnetron sputtering coating machine, manufactured by Beijing Beiyi Innovation Vacuum Technology Co., Ltd., model JP-900A), the PC sheet with a thickness of 0.8 mm is placed on the magnetron sputtering ion plating On the workpiece rack in the vacuum chamber of the equipment, start the vacuum pump to evacuate, and the vacuum degree in the vacuum chamber reaches 4×10 -3 Pa, fill with argon to make the absolute pressure in the vacuum chamber 0.7 Pa, and adjust the temperature in the vacuum chamber to 70°C. Start the DC power supply (voltage is 450 volts, current is 12 amps) applied on the magnetron target (target material is 99.99% tin), under the above temperature and pressure conditions, sputter for 80 seconds to form on the PC sheet A tin plating layer with a thickness of 60 nanometers...

Embodiment 2

[0025] This embodiment is used to illustrate the preparation method of the housing of the electronic product provided by the present invention.

[0026] Using magnetron sputtering equipment (DC magnetron sputtering coating machine, manufactured by Beijing Beiyi Innovation Vacuum Technology Co., Ltd., model JP-900A), the PET sheet with a thickness of 1 mm is placed on the magnetron sputtering equipment. On the workpiece rack in the vacuum chamber, start the vacuum pump to evacuate, and the vacuum degree in the vacuum chamber reaches 6×10 -3 Pa, fill with argon to make the absolute pressure in the vacuum chamber 0.5 Pa, and adjust the temperature in the vacuum chamber to 60°C. Start the DC power supply (voltage is 420 volts, current is 10 amps) that is applied on the magnetron target (the target material is 99.99% tin), and under the above-mentioned temperature and pressure conditions, sputter 60 seconds, form on the PC sheet material A tin plating layer with a thickness of 45 ...

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Abstract

The invention provides a preparation method of an electronic product casing, including forming a tin coating on matrix materials. The method of forming the tin coating on the matrix materials is a DC magnetic control sputtering coating method which includes imposing voltage on a magnetic control target to sputter and deposit target materials of the magnetic control target on the matrix materials under the sputtering condition. The target materials are tin. The sputtering condition results in that the thickness of the tin coating is not larger than 100nm. The preparation method of the electronic product coating provided by the invention uses the DC magnetic control sputtering coating method to form the tin coating on the matrix materials and control the sputtering condition to keep the thickness of the tin coating to be within 100nm. Therefore, the obtained casing is provided with certain transmittance and the light transmission decoration effect is achieved.

Description

technical field [0001] The invention relates to a method for preparing an electronic product casing. Background technique [0002] Electronic product casings generally use plastic as the base material, and the plastic surface is decorated by methods such as coating, electroplating, chemical vapor deposition, and physical vapor deposition. However, the metal decorative film layers prepared by the above methods all have conductivity, which can shield radio-frequency electromagnetic waves, which will affect the work of products that do not need to shield electromagnetic waves. [0003] For this reason, CN 1730719A discloses a kind of preparation method of non-conductive plastic surface metal film layer, and this method utilizes vacuum radio frequency ion to evaporate metal material and is plated on the plastic product surface, realizes by following steps: adopt metal tin as coating material, The material is made into a tin wire with a mass of 0.05-0.20 grams and a length of 1....

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/14C23C14/54C23C14/20
Inventor 薛会敏钟源陈晓梅宫清
Owner BYD CO LTD
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