Recovery cup cleaning method and substrate treatment apparatus

A substrate processing device and substrate processing technology, applied in cleaning methods and tools, cleaning methods using liquids, chemical instruments and methods, etc., capable of solving problems such as substrate contamination, reduction in processing rate, and deterioration of chemical solutions

Inactive Publication Date: 2008-06-25
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, there is a problem that sometimes there are foreign substances in the chemical solution recovered from the chemical solution recovery path, and they become particles and become a cause of contamination of the substrate
If the cleaning solution is mixed with the chemical solution, the chemical solution will be diluted and deteriorated, resulting in a decrease in the throughput during substrate processing

Method used

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  • Recovery cup cleaning method and substrate treatment apparatus
  • Recovery cup cleaning method and substrate treatment apparatus
  • Recovery cup cleaning method and substrate treatment apparatus

Examples

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Effect test

Embodiment Construction

[0036] FIG. 1 is a schematic plan view showing the layout of a substrate processing apparatus in one embodiment (first embodiment) of the present invention. This substrate processing apparatus is a single-sheet type apparatus that processes semiconductor wafers (hereinafter simply referred to as "wafers") W as an example of a substrate one by one, and includes: an indexer unit 1; a substrate coupled to one side of the indexer unit 1 processing unit 2; a plurality of (three in this embodiment) cassette holding units 3 arranged in parallel on the other side of the indexer unit 1 (the side opposite to the substrate processing unit 2). Cassette C1 (Front Opening Unified Pod: Front Opening Unified Pod: Front Opening Unified Pod: Front Opening Unified Pod) that accommodates and holds a plurality of wafers in a stacked state is loaded in each cassette holder 3 , SMIF (Standard Mechanical Inter Face: standard mechanical interface) container, OC (Open Cassette: open box), etc.).

[00...

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PUM

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Abstract

An inventive recovery cup cleaning method is a method for cleaning a recovery cup having an interior wall partitioning a recovery space into which a chemical agent used for treating a substrate is introduced, the recovery cup being configured such that the chemical agent introduced into the recovery space is further introduced into a predetermined chemical agent recovery passage so as to be recovered. The method comprises the steps of: cleaning the interior wall of the recovery space with a cleaning liquid; cleaning the interior wall of the recovery space with a chemical cleaning agent after the step of cleaning with the cleaning liquid, the chemical cleaning agent being of the same type as the chemical agent to be recovered through the recovery space; and draining the cleaning liquid introduced into the recovery space in the step of cleaning with the cleaning liquid and the chemical cleaning agent introduced into the recovery space in the step of cleaning with the chemical cleaning agent through a drain passage which is different from the chemical agent recovery passage.

Description

technical field [0001] The present invention relates to a recovery cup cleaning method for cleaning a recovery cup and a substrate processing device adopting the recovery cup cleaning method. The recovery cup is used for guiding the chemical liquid used in substrate processing. Substrates to be processed include, for example, semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for plasma displays, substrates for FED (Field Emission Display: Field Emission Display), substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks. , Substrates for photomasks, etc. Background technique [0002] In the manufacturing process of semiconductor devices and liquid crystal display devices, in order to apply chemical liquid treatment to the surface of substrates such as semiconductor wafers and glass substrates for liquid crystal display panels, a single substrate processing apparatus is used that processes s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B9/08B08B3/08B08B3/10H01L21/302G03F1/82G11B5/84G11B7/26H01L21/027H01L21/304H01L21/306
CPCH01L21/67023H01L21/67051H01L21/6708H01L21/02H01L21/304
Inventor 桥诘彰夫
Owner DAINIPPON SCREEN MTG CO LTD
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