Recovery cup cleaning method and substrate treatment apparatus
A substrate processing device and substrate processing technology, applied in cleaning methods and tools, cleaning methods using liquids, chemical instruments and methods, etc., capable of solving problems such as substrate contamination, reduction in processing rate, and deterioration of chemical solutions
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[0036] FIG. 1 is a schematic plan view showing the layout of a substrate processing apparatus in one embodiment (first embodiment) of the present invention. This substrate processing apparatus is a single-sheet type apparatus that processes semiconductor wafers (hereinafter simply referred to as "wafers") W as an example of a substrate one by one, and includes: an indexer unit 1; a substrate coupled to one side of the indexer unit 1 processing unit 2; a plurality of (three in this embodiment) cassette holding units 3 arranged in parallel on the other side of the indexer unit 1 (the side opposite to the substrate processing unit 2). Cassette C1 (Front Opening Unified Pod: Front Opening Unified Pod: Front Opening Unified Pod: Front Opening Unified Pod) that accommodates and holds a plurality of wafers in a stacked state is loaded in each cassette holder 3 , SMIF (Standard Mechanical Inter Face: standard mechanical interface) container, OC (Open Cassette: open box), etc.).
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