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Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components

An abrasive slurry, used technology, used in separation methods, fine working devices, grinding/polishing safety devices, etc., can solve problems such as consumption of large amounts of chemical reagents

Inactive Publication Date: 2008-07-09
SIC PROCESSING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0035] A big drawback of the above method is that, in addition to the complexity of the series of operations required to recover and purify the solid fraction, the leaching step of the method requires the consumption of a large amount of chemical reagents in solution

Method used

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  • Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components
  • Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components
  • Process and apparatus for treating exhausted abrasive slurries for the recovery of their reusable components

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Embodiment Construction

[0080] like figure 1 As shown in the block diagram of , the method of the present invention and the device specially designed for implementing the method are mainly composed of three interconnected processing sections, the first two sections (represented by the left column of the diagram) are used for recovery and purification of reusable Abrasive particles, while the third section (right column) is used to process and recover the suspension liquid.

[0081] The used slurry from the cutting section of the silicon crystal ingot has a solids content of 50-55% by weight, and here for illustration it contains:

[0082] ■Reusable silicon carbide abrasive grains with a particle size between 4 and 35 μm for large-grained abrasive suspensions (type F500) and between 4 and 35 μm for fine-grained abrasive suspensions (type JS 1500 or JS 2000) Between 25 μm; in this example, these abrasive particles accounted for 34-39% by weight of the slurry;

[0083] ■ Non-reusable abrasive particle...

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Abstract

Process for completely recovering the reusable components of an abrasive slurry used in slicing crystalline materials of silicon, quartz or ceramics when it becomes exhausted and enriched with undesired waste matter. The process consists of an initial centrifuge separation of the exhausted slurry as such and of a wet size-sorting treatment of the fraction containing the abrasive grains obtained from the centrifuge, carried out in a battery of hydrocyclones or centrifuges connected in series. The section for the recovery and purification of the abrasive grains comprises a multifunctional apparatus that performs all the required operations within a single pressure vessel. The process enables the complete recovery of the reusable abrasive grains contained in the exhausted slurry as well as of the suspending or cutting liquid of the abrasive slurry, in order to reuse both components in the manufacturing process. The invention also concerns an apparatus for carrying out the treatment of exhausted abrasive slurries according to the process described.

Description

technical field [0001] The present invention relates to a method and a device corresponding thereto for the treatment of spent abrasive slurry in order to recover its reusable components. More precisely, the present invention relates to a method and the necessary apparatus for its implementation, for the extraction of abrasive slurries from spent, cut silicon, quartz or ceramic crystalline material, which is rich in undesired waste, The reusable components contained in the grinding slurry are fully recovered. The method allows for the complete recovery of the still reusable abrasive particles contained in the spent slurry as well as the complete recovery of the suspension of the abrasive slurry so that both components can be reused in the production process. Background technique [0002] It is well known to produce components used in the electronics and photovoltaic energy fields using thin silicon disks ("wafers") obtained by cutting polycrystalline or monocrystalline sili...

Claims

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Application Information

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IPC IPC(8): B24B57/00B03B9/06B01D21/00B04C7/00B04B5/10
CPCB01D3/00B01D21/0012B01J39/04B24B55/12B24B57/00B28D5/007B01D21/009B01D21/0093B01D21/262C01B33/037Y02P70/10B01J41/04B03B9/06B04B5/10B04C7/00
Inventor G·弗兰吉亚科莫
Owner SIC PROCESSING
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