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Target device for sputtering

A target device and sputtering technology, applied in the field of sputtering targets, can solve the problems of uneven surface, degraded sputtering quality, difficult sputtering, etc., and achieve the effects of increasing use efficiency, saving costs, and prolonging use time

Inactive Publication Date: 2012-03-21
SAMSUNG CORNING ADVANCED GLASS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the surface of the target is not uniform, there is a problem of quality degradation due to sputtering
[0007] In addition, Patent Document 2 discloses the technique of using a multi-zone target, but forming the target from different materials, and intending to make the differentiated erosion uniform
However, since the components of the target materials are different from each other, there is also a problem that it is difficult to expect uniform sputtering in this case

Method used

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  • Target device for sputtering
  • Target device for sputtering
  • Target device for sputtering

Examples

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Embodiment Construction

[0033] Hereinafter, a backplane unit according to an exemplary embodiment of the present invention will be described with reference to the drawings. The same reference symbols designate substantially the same elements in this specification for reference. According to the above principles, the content described in other drawings may be cited for description, and the content judged to be obvious or redundant to those skilled in the art may be omitted.

[0034] figure 1 is a perspective view showing a sputtering target device according to one embodiment of the present invention, figure 2 yes figure 1 Cross-sectional view of the sputtering target setup.

[0035] refer to figure 1 with figure 2 , the sputtering target device includes a back plate 110 , a reference target 120 and a reinforcement target 130 . In this embodiment, the target device is used to form a thin film made of Si, Ta, Al, ZnO, ITO, etc., and the reference target 120 and the reinforcing target 130 are for...

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PUM

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Abstract

The invention relates to a sputtering target device disposed in a width direction relative to the moving direction of a large-area object, wherein the sputtering target device comprises: a backboard comprising a center surface and at least one step surface at both sides of the center surface to reduce a defined grading; a reference target material installed at the center surface of the backboard;and a reinforcing target material installed at the step surfaces of the backboard.

Description

technical field [0001] The present invention relates to a sputtering target used in the manufacture of thin films, and more particularly to a sputtering target which can be easily used, repaired and managed after being mounted on a back plate. Background technique [0002] As the transparent film, ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), ITZO, etc. are used. These films are currently being used as display electrodes for flat panel displays (FPDs) such as liquid crystal displays (LCDs) and plasma displays (PDPs) because of their high conductivity and high transmittance, and their ease of microfabrication. [0003] The production methods of ITO thin films are divided into chemical film formation methods such as spray pyrolysis method and CVD method, and physical film formation methods such as electron beam evaporation method and sputtering method. Among them, the sputtering method using an ITO target is used in most ITO film-forming processes because it is easy to inc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34
CPCC23C14/3407C23C14/35
Inventor 尹汉镐赵祐奭金眩秀金仁燮崔成龙崔智雄朴喆基朴炯律
Owner SAMSUNG CORNING ADVANCED GLASS LLC