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Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment

A technology of information technology equipment and printed circuit boards, which is applied to printed circuit components, printed circuits, printed circuits, etc., can solve problems such as inability to eliminate restrictions, large leakage of electromagnetic waves, etc.

Inactive Publication Date: 2008-07-23
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the leakage amount of the electromagnetic wave leaked through the periphery of the opening portion becomes extremely large, which may cause a problem that the restriction prescribed by the EMI standard cannot be eliminated.
[0010] In addition, when the butterfly connection structure is adopted as the memory module connection structure, unnecessary electromagnetic waves may be generated at the terminal portions of the two connectors arranged in parallel to each other to connect the two memories

Method used

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  • Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment
  • Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment
  • Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment

Examples

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Embodiment Construction

[0028] Embodiments according to the present invention will be described with reference to the drawings.

[0029] FIG. 1 is a schematic perspective view of a notebook PC as an embodiment of an information technology device employing the present invention. The notebook PC has a main body portion 4 in which a keyboard 2 and a display portion 6 rotatable relative to the main body portion 4 are provided. The main body portion 4 has a case 8 , and the keyboard 2 is provided on the upper surface of the case 8 . Housed within the housing 8 are: a circuit board on which a CPU and a memory module are mounted; a storage device such as a hard disk drive; a module for communicating with external devices; a plurality of connectors and the like.

[0030] Consider a case where two memory modules are installed in the notebook PC shown in FIG. 1 . FIG. 2 is a schematic plan view of the case 8 of the notebook PC shown in FIG. 1 viewed from the bottom side (the side opposite to the keyboard 2)....

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Abstract

The invention provides a printed circuit board assembly, a casing of an information technology device, and the information technology device. The printed circuit board assembly is constructed and arranged to mount a memory module on the printed circuit board assembly. At least two connectors are mounted on the printed circuit board. The connector is configured to connect the memory module to the connector. An electromagnetic wave absorbing sheet is provided on at least one of the connectors. The electromagnetic wave absorbing sheet is installed to cover a side surface of the one connector opposite to a side surface of the other connector.

Description

technical field [0001] The present invention relates to information technology equipment, and particularly to an information technology equipment such as a notebook type personal computer provided with an opening portion for replacing a memory module. Background technique [0002] It has become absolutely necessary in recent years that the electromagnetic interference (EMI) and electrostatic discharge (ESD) Take measures. In EMC, specifically, regulations have been strengthened for EMI, and each country enforces its own regulations. Manufacturers of information technology equipment cannot sell or export products unless they eliminate the restrictions imposed by the standards related to EMI regulations. As standards related to EMI regulations, for example, there are VCCI protocols in Japan and FCC regulations in the United States. [0003] As an international standard used as a basis for standards related to EMI regulation, there is a standard established by the Internatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K5/02H05K9/00
CPCH05K1/0218H05K1/141H05K9/0018H05K9/0084H05K2201/10189H05K2203/1311H01R13/6599H01L23/50H05K9/00H05K1/02
Inventor 田中义朗本间敏行上栫秀明
Owner FUJITSU LTD