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Etching liquid and method for manufacturing printed circuit board

A printed circuit board and printed circuit board technology, applied in the field of etching solution, can solve the problems of high content of organic additives, insufficient ability to inhibit side erosion, and difficulty in wastewater treatment, and achieve the effect of low content of organic additives and reduction of side erosion

Inactive Publication Date: 2008-07-30
SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY
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AI Technical Summary

Problems solved by technology

[0005] However, the content of organic additives in these etching solutions is high, and there are difficulties in wastewater treatment
In addition, the etchant has insufficient ability to suppress undercutting in some cases

Method used

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  • Etching liquid and method for manufacturing printed circuit board
  • Etching liquid and method for manufacturing printed circuit board

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Embodiment Construction

[0025] As shown in Fig. 1, 2, 3 embodiments form the method for printed circuit board circuit pattern by etching copper and copper alloy as follows:

[0026] As shown in FIG. 1 , a copper foil 2 is coated with an anti-etching layer 3 with a circuit pattern, and an etching solution is used to remove the part of the copper foil not covered by the anti-etching layer 3 .

[0027] The etchant is sprayed on the surface of the copper foil 3 using a conventional horizontal spray etching device, and the copper foil portion 2A not covered by the anti-etching layer 3 is etched away ( FIG. 2 ).

[0028] The solution temperature of the etching solution is 20-55° C., preferably 40-50° C., the spray pressure is 0.1-0.3 MPa, and the etching time is set according to the copper thickness.

[0029] After copper is etched, the cuprous ions produced in the etching solution will lose the etching ability. In order to restore the etching ability of the etching solution, air can be passed into the et...

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Abstract

The invention relates to an etchant used for manufacturing a printing circuit board, is characterized in that the etchant contains bivalent copper ions, hydrochloric, poly-guanidine and water. The invention still relates to an etching method for a printing circuit board and includes the following steps: firstly, the etchant is used for contacting the surface of copper or the copper alloy of the printing circuit board; and secondly, the surface is covered by an organic coating. Compared with the prior art, the invention has the advantages that the organic addition agent of the etchant has a low content, therefore, the side etching can be reduced effectively and a fine circuit diagram can be formed as well.

Description

technical field [0001] The invention relates to an etching solution for manufacturing printed circuit boards and an etching method for manufacturing circuit patterns of printed circuit boards with the etching solution. Background technique [0002] In the process of manufacturing printed circuit boards by the existing subtractive method (hole masking method), ferric chloride-based etching solutions, copper chloride-based etching solutions and alkaline etching solutions are generally used to form circuit patterns. When circuit patterns are formed using these etching solutions, a part of the copper foil covered with the etching resist layer is additionally etched away in the horizontal direction, and this phenomenon is called undercutting. Such side etching narrows the line width, making it difficult to achieve high-density wiring. [0003] The additive method can realize high-density wiring, but the process is complicated, and the printed circuit board manufactured by this m...

Claims

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Application Information

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IPC IPC(8): C23F1/18
Inventor 林旭荣时焕英黄志东林海鸿潘伟明罗旭林吉平张学东
Owner SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY
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