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Electronic packaging structure

A technology for electronic packaging and electronic components, which is applied to circuits, electrical components, electrical solid devices, etc., can solve the problems of large volume, low space utilization rate of the printed circuit board 110 and the packaging substrate 210, etc., and achieve the effect of high density

Active Publication Date: 2008-08-20
CYNTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the existing electronic packaging structures 100 and 200, the space utilization ratio of the printed circuit board 110 and the packaging substrate 210 is low, and the volume of the existing electronic packaging structures 100 and 200 is relatively large.

Method used

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Examples

Experimental program
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no. 1 example

[0045] Please refer to FIG. 3A , which is a schematic cross-sectional view of an electronic packaging structure according to the first embodiment of the present invention. The electronic packaging structure 300 of the first embodiment includes a first carrier 310, at least one first electronic component 320 (four are schematically shown in FIG. 3A ), and at least one second electronic component 330 (one is schematically shown in FIG. 3A ). ) with a colloid 340. The first carrier 310 has a first carrying surface 312 and a second carrying surface 314 opposite to each other. The first electronic components 320 are disposed on the first carrying surface 312 and electrically connected to the first carrier 310 . The second electronic component 330 is disposed on the second carrying surface 314 and electrically connected to the first carrier 310 .

[0046]In this embodiment, the volume of the second electronic component 330 may be greater than that of the first electronic component...

no. 2 example

[0055] Please refer to FIG. 4 , which is a schematic cross-sectional view of an electronic packaging structure according to a second embodiment of the present invention. The difference between the electronic packaging structure 400 of the second embodiment and the electronic packaging structure 300, 300' of the first embodiment is that the electronic packaging structure 400 further includes a second carrier 460, and the number of the first electronic components 420 is Multiple. Some of these first electronic components 420 are disposed on the second carrier 460 and electrically connected to the second carrier 460, and the second carrier 460 is disposed on the first carrying surface 412 of the first carrier 410 and electrically connected to the first carrier 410 . In other words, in this embodiment, some of these first electronic components 420 are indirectly disposed on the first carrying surface 412, and the rest of these first electronic components 420 (only the rightmost f...

no. 3 example

[0059] Please refer to FIG. 5 , which is a schematic cross-sectional view of an electronic packaging structure according to a third embodiment of the present invention. In the electronic package structure 500 of the third embodiment, the second carrier 560 such as a circuit board is disposed on the first carrier surface 512 of the first carrier 510 such as a lead frame and is electrically connected to the first carrier 510. There are multiple first electronic components 520 , and these first electronic components 520 are indirectly disposed on the first carrying surface 512 through the second carrier 560 . As far as the relative positions shown in FIG. 5 are concerned, the first electronic components 520 disposed on the second carrier 560 are respectively resistors, capacitors, logic control elements, capacitors and resistors from left to right. In addition, there are multiple second electronic components 530, and these second electronic components 530 arranged on the second ...

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Abstract

The present invention relates to an electronic encapsulation structure comprising of a first loader, at least one first electronic element, at least one second electronic element and a colloid. The first loader has a first bearing surface and a second bearing surface face to face. The first electronic element is set on first bearing surface and connected electrically with first loader. The second electronic element is set on the second bearing surface and connected electrically with the first loader. The colloid at least coats the first electronic element, the second element and partially coats the first loader. So the space utilization of first loader of electronic encapsulation structure is high.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to an electronic packaging structure. Background technique [0002] The electronic packaging structure is a product formed after complicated packaging process steps. Various electronic packaging structures have different electrical performance and capacity of heat dissipation, so designers can choose electronic packaging structures that meet their electrical performance and heat dissipation requirements according to their design requirements. [0003] Please refer to FIG. 1 , which shows a schematic diagram of a conventional electronic packaging structure. The conventional electronic package structure 100 includes a printed circuit board (PCB) 110 and a plurality of electronic elements 120 . The electronic components 120 are disposed on a surface 112 of the printed circuit board 110 and are electrically connected to the printed circuit board 110 . The printed circuit board 110...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/31
CPCH01L2924/1305H01L2224/48091H01L2924/0002H01L2224/48247H01L2924/13091H01L2924/13055
Inventor 陈大容方崇训吕保儒林逸程温兆均
Owner CYNTEC
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