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Conductive resin coating metal panel

A conductive resin and metal plate technology, applied in the direction of metal layered products, electrical components, magnetic field/electric field shielding, etc., to achieve good conductivity

Inactive Publication Date: 2008-09-24
KOBE STEEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is based on the following technical idea: by including a large amount of particles with small particle diameters in the coating layer, even if the film thickness becomes thicker, it is possible to ensure the necessary electrical path for solderability. conduct research on the

Method used

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  • Conductive resin coating metal panel
  • Conductive resin coating metal panel
  • Conductive resin coating metal panel

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0073] First, an embodiment of the aforementioned first invention will be shown.

[0074] (Metal plate)

[0075] The metal plates used and their abbreviations are shown below. In addition, plating is performed on both surfaces of the metal plate.

[0076] GA: Alloyed hot-dip galvanized steel sheet...Thickness: 0.8mm, plating adhesion: 30g / m on one side 2 , the amount of Fe in plating: 8.6%

[0077] EG: Electro-galvanized steel sheet...Thickness: 0.8mm, plating adhesion: 20g / m on one side 2

[0078] GI: Hot-dip galvanized steel sheet...Thickness: 0.6mm, plating adhesion: 60g / m on one side 2 ,

[0079] Al: Aluminum plate...Thickness: 0.6mm

[0080] (Matrix resin)

[0081] Organic solvent-soluble polyester resin VYLON (registered trademark) series manufactured by Toyobo Co., Ltd. was used. Displays the species used and Tg.

[0082] VYLON 550 (Tg: -15°C), VYLON 500 (Tg: 4°C), VYLON GK 130 (Tg: 15°C), VYLON GK 140 (Tg: 20°C), VYLON GK 780 (Tg: 36°C), VYLON 296 (Tg: 71°C)...

no. 2 example

[0160] Next, an embodiment of the aforementioned second invention will be shown.

[0161] (Metal plate)

[0162]The metal plates used and their abbreviations are shown below. In addition, plating is performed on both surfaces of the metal plate. In addition, "CTE-213" manufactured by Parkerizing Co., Ltd. of Japan was used on the plated steel sheet at 100 mg / m 2 The amount of adhesion is carried out for substrate treatment.

[0163] GA: Alloyed hot-dip galvanized steel sheet...Thickness: 0.8mm, plating adhesion: 30g / m on one side 2 , the amount of Fe in plating: 10.3%

[0164] EG: Electro-galvanized steel sheet...Thickness: 0.8mm, plating adhesion: 20g / m on one side 2

[0165] (Matrix resin)

[0166] As the matrix resin, an organic solvent-soluble polyester resin "VYLON (registered trademark) 650" manufactured by Toyobo Co., Ltd. was used. The Tg of the catalog value is 10°C, and the molecular weight (Mn) is 23×10 4 .

[0167] (crosslinking agent)

[0168] A melamin...

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Abstract

A conducting resin coating metal plate is provided, which is located on a surface of the metal plate and covered with a conducting resin film comprising conducting particles, even on condition of small contact pressure, the invention still can exert sufficient conductivity. The conducting resin coating metal plate is covered with the conducting resin film comprising conducting particles on the surface of the metal plate; the conducting particles is contained in a range from 20 to 65% by mass on the conducting resin film; resin in the conducting resin film has Tg of -10 DEG C to +30 DEG C, thickness of the conducting resin film is 1.2 to 14 mum; content of the conducting particles is set as w (mass%), average particle size of the conducting particles is set as r (mum), thickness of the conducting particles is set as t (mum), thus equaling to the formula (i): w*(r / t) is no less than 30 and no more than 200 (i).

Description

technical field [0001] The present invention relates to a resin-coated metal sheet having excellent electrical conductivity useful as a constituting material for casings for electronic equipment such as audio-visual (AV) equipment, personal computer peripheral equipment, Internet connection equipment, and vehicle-mounted information terminals. Background technique [0002] As a recent trend in the field of electronic equipment, new performance improvements such as high-speed information processing and transmission capabilities and increased recording capacity are being promoted, and electromagnetic waves leaking from electronic equipment tend to increase. If the leakage of electromagnetic waves increases, it will lead to misoperation of the precision machinery arranged around the electronic equipment, so countermeasures are needed. In order to improve the shielding (conductivity) of electromagnetic waves to prevent leakage, electronic equipment manufacturers are faced with th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B32B15/08
Inventor 五十岚哲也渡濑岳史平野康雄
Owner KOBE STEEL LTD