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Manufacturing method of light emitting diode substrate

A technology for a light-emitting diode and a manufacturing method, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve the problems of low reproducibility and incompatibility of the shape and size of the reflector, and achieve the effect of simplifying the manufacturing process and reducing the cost.

Inactive Publication Date: 2008-10-01
TATSUTA SYST ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, this method has a problem that the reproducibility of the shape and size of the reflection part is slightly low, and it is not suitable for occasions requiring high precision.

Method used

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  • Manufacturing method of light emitting diode substrate
  • Manufacturing method of light emitting diode substrate
  • Manufacturing method of light emitting diode substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0057] Examples of the present invention are shown below, but the present invention is not limited to the following examples.

[0058] The following epoxy resins, curing agents, and silver-coated copper powder were mixed in the ratios (weight ratios) shown below to prepare thermally conductive conductive pastes. In addition, the details of each component are as follows.

[0059] Epoxy resin: epoxy resin EP-4901E (manufactured by Asahi Denka Co., Ltd.) 80% by weight, ED-529 (manufactured by Asahi Denka Kogyo Co., Ltd.) 20% by weight, 100 parts by weight

[0060] Curing agent: 15 parts by weight of 2-ethylimidazole (Shikoku Chemical Industry Co., Ltd.)

[0061] Copper powder coated with silver: average particle size 10 μm, spherical powder, silver coating amount 10wt% 800 parts by weight

[0062] At 25°C, using a BH type viscometer with a No. 7 (10 rpm) rotor, when measuring the viscosity of the above paste, the viscosity was 1800.

[0063] Prepare figure 1 The circuit-forme...

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Abstract

This invention discloses a fabrication method of LED substrate, which is applied to enhancing brightness of LCD without adhesion process using adhesive, and is able to precisely form reflection portion having expected shape and size with low cost. The fabrication method comprises steps as follows: coating conductive paste onto substrate surface disposed with loop; heating and solidifying the conductive paste; perforating solidified conductive paste via drill with top part of conical table shape in position arranged with the LCD, so as to form space comprising tapered side wall face which is regarded as reflection portion.

Description

technical field [0001] The invention relates to a manufacturing method of a light emitting diode substrate, the light emitting diode substrate has a reflective part so that the light emitting diode has high brightness. Background technique [0002] At present, when a reflective part is provided to make the light-emitting diode have high brightness, in order to form the reflective part, as described in Patent Document 1, heat-resistant engineering plastic resin such as polycarbonate is usually used as a material, and injection molding, Melt molding, extrusion molding, etc., to form a certain shape of the reflective component material, perform electroless nickel plating, silver plating, and then bond it to a certain light-emitting diode substrate through an adhesive. [0003] However, the above-mentioned method requires an expensive mold when forming the reflective member material, and requires a multi-step process in the process of forming the reflective part, requiring consi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/60H01L33/62
CPCH01L2224/48091H01L2224/73265H01L2224/45139H01L2924/00011H01L2924/00014H01L2924/00H01L2924/01049H01L2924/01005H01L2224/45015H01L2924/207
Inventor 岩井靖村上久敏
Owner TATSUTA SYST ELECTRONICS