Manufacturing method of support pin, support pin, heat treatment device and base board sintering furnace
A manufacturing method and technology of support pins, applied in semiconductor/solid-state device manufacturing, furnaces, furnace types, etc., can solve problems such as sufficient durability, and achieve low-cost effects
Inactive Publication Date: 2008-10-22
FUTURE VISION
View PDF3 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0013]However, with the conventional technology of obtaining molded products by vacuum injection molding, although a large number of oxidized parts do not occur on the surface of molded products, local The thermal decomposition of the reactive part will be exposed on the surface of the molded product, so it is possible to start oxidative decomposition or thermal decomposition from these parts
That is, if the support pin is manufactured by vacuum injection molding, a support pin with high durability can be obtained to some extent, but it cannot be said that the durability is sufficient.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0040]
[0041] The support pin 100 according to the embodiment of the present invention will be described. The support pin 100 is a component constituting a substrate processing apparatus that performs various processes on a substrate. In particular, in a processing section that performs a heat treatment on a substrate (for example, a substrate firing furnace 1 that performs a firing treatment on a substrate (refer to Figure 4 )) is suitable as a member for supporting a substrate subjected to heat treatment.
[0042] like figure 1 As shown, the support pin 100 has a main body 101 and a fluorocarbon film (CFx film) 102 as a protective film covering the main body 101 . figure 1 is a sectional view of the support pin 100. refer to figure 2 A method of manufacturing the support pin 100 will be described. but figure 2 It is a flowchart showing the manufacturing process of the support pin 100 .
[0043] When manufacturing the support pin 100 , under a given circumstance...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a manufacturing method for a support pin, a support pin, a thermal treatment device and a substrate firing furnace. The support pin supports a substrate processed by thermal treatment, which has high durability of thermal decomposition and oxygenolysis. The method comprises the following steps of firstly, ejecting a shaped material (resin preferably) of a main body (101) shaped in a specific pin shape under the condition of oxygen and / or water with concentration lower than 10 ppm, so as to form a main body (101) of the support pin (100), and then, forming a fluorocarbon membrane (102) through electrostatic powder coating on the surface of the obtained main body (101), so as to obtain the support pin (100) that supports the substrate processed by thermal treatment.
Description
technical field [0001] The present invention relates to heat treatment of semiconductor substrates, glass substrates for liquid crystal display devices, glass substrates for photomasks, glass substrates for plasma displays, substrates for optical discs, etc. (hereinafter referred to as "substrates") The processed substrate is supported on support pins. Background technique [0002] A substrate processing apparatus for performing a series of processes on a substrate has a unit processing section (for example, a firing processing section, a cleaning processing section, a resist coating section, a developing section, etc.) that performs various processing on a substrate. [0003] In a substrate processing apparatus, such as a substrate firing furnace, in a processing section that heats a substrate, components installed in the processing section are exposed to high temperatures. Therefore, parts are required to have high durability against thermal decomposition and oxidative de...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L21/683H01L21/00F27B17/00F27D3/12C23C16/458B29C45/00B29K96/00B29K77/00
CPCH01L21/67098H01L21/68757
Inventor 大见忠弘村冈祐介宫路恭祥
Owner FUTURE VISION