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Structure of welding mat

A technology of soldering pads and metal layers, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of solder ball drop, conduction, etc., to improve yield, solve the problem of solder ball drop or abnormal conduction Effect

Active Publication Date: 2011-08-31
NAN YA PRINTED CIRCUIT BOARD CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The solder pad structure should be able to achieve the effect of solving the problem of solder ball dropping or abnormal conduction in the back-end manufacturing process of the package substrate

Method used

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  • Structure of welding mat
  • Structure of welding mat
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Embodiment Construction

[0045] The present invention will be described in detail below in conjunction with the accompanying drawings, but the implementation scope of the present invention is not limited.

[0046] The invention relates to an improved manufacturing process of the back section of the packaging substrate and the resulting welding pads, including solder paste printing on the open-loop welding pads, followed by reflow manufacturing process, forming a stable solder pad on the open-loop welding pads. And the solder balls in firm contact.

[0047] The present invention can effectively solve the problem that the solder paste cannot be fully squeezed into the opening due to the too small opening diameter of the resist in the prior art, so that the phenomenon of solder ball dropping or the generation of solder balls occurs during the subsequent reflow manufacturing process. Therefore, the present invention can improve the yield rate of products.

[0048] In addition, the present invention also ...

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Abstract

The invention provides a weld pad structure, which comprises a first metallic layer, an anti-welding retarding agent layer, a second metallic layer and a tin ball, wherein, the first metallic layer is arranged on an insulating layer and electrically connected with a lower circuit which is formed inside the insulating layer through a through hole under the first metallic layer; the anti-welding retarding agent layer is provided with a retarding agent opening which exposes the central section of the first metallic layer; the second metallic layer is stacked on the first metallic layer in the retarding agent opening to form a centrally protruded column structure; and the tin ball is filled into the retarding agent opening and at least contact the second metallic layer.

Description

technical field [0001] The present invention relates to the technical field of packaging substrates, and provides a special welding pad structure and a manufacturing method on the chip end surface of the packaging substrate, which can improve the reliability of solder ball bonding. Background technique [0002] Under the trend of continuous development of light, thin, short and small electronic products, the market pays more and more attention to flip-chip packaging technology. Compared with traditional packaging methods, flip-chip technology has multiple advantages, making it the focus of the development of the packaging and testing industry in recent years. In ball grid array package (BGA, also known as ball grid array), inverted core (chip) chip or inverted solder core (chip) chip (flip-chip, also known as flip chip) and other high-level ball-planting packages With the trend of gradually becoming the mainstream packaging technology, the packaging substrate manufacturing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/498
CPCH01L2924/0002
Inventor 朱志忠林世宗林贤杰
Owner NAN YA PRINTED CIRCUIT BOARD CORPORATION