System realizing three-dimensional interconnection between multi-systems

Abstract

The invention belongs to the micro-electronic filed, in particular relating to a system for realizing 3D interconnection among a plurality of systems. The system comprises a data sampling and maintaining module, a radio frequency interface module, a time sequence control module and a multi-layered communication system, wherein, a non-contact interconnection structure among the plurality of systems is realized through deposition of transformers on areas on which each layer of communication system is interconnected and by utilization of silicon-based millimeter waves. Compared with the prior contact interconnection structure, the non-contact interconnection structure greatly reduces the problem of wastage of through holes and greatly improves the ability of the system in processing ultrahigh-frequency ultrahigh-speed signals. The system is completely compatible with the modern standard CMOS technique, does not need to customize a brand new mask plate, greatly reduces the complexity of the interconnection technique, and improves the stability and the reliability of multi-system ultrahigh-frequency ultrahigh-speed interconnection.

Description

technical field [0001] The invention belongs to the field of microelectronics, and in particular relates to a three-dimensional interconnection system for realizing ultra-high-speed and ultra-high-frequency interconnection among multiple systems by using silicon-based millimeter waves. Background technique [0002] With the development of electronic systems towards miniaturization, high performance, multi-function, low cost and high reliability, system-level integrated circuits have become an inevitable trend of development. With the continuous improvement of integrated circuit integration, the number of device units on each chip has increased sharply, and the chip area has increased. The growth of inter-unit connections not only affects the working speed of the circuit but also takes up a lot of area, which seriously affects the further improvement of the integrated level and working speed of the integrated circuit. . Especially as SOC (system on chip) has become the deve...

AI Technical Summary

Problems solved by technology

In 2004, Tezzaron Semiconductor researched and developed a three-dimensional interconnection technology called Fastack, which divides the design into two or more ICs, assuming that the memory is placed on one die and the microcontroller is placed on the other. During circular processing, shorter connections are created by placing vias and interconnects at corresponding locations on the two die when the die are stacked together

[0009]1. The area occupied by interconnection wires keeps rising;

[0010]2. The inter-system communication delay, inter-system coupling and transmission loss caused by longer interconnect lines have become the bottleneck of system-on-chip performance improvement;

[0011]3. The reliability and stability of the through-hole connection between different levels deteriorates rapidly

The reliability and stability of the via contact will deteriorate dramatically due to the increase of the via depth

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