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Surface mounting technology print stencil net frame

A surface mount technology and printing template technology, which are used in printing, assembling printed circuits with electrical components, printing machines, etc., can solve problems such as uneven tension of steel sheets, offset printing solder paste, and affecting the quality of printing solder paste. To achieve the effect of improving quality and improving bending strength

Active Publication Date: 2008-11-12
SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Because of the above-mentioned differences, the traditional silk screen frame is not strong enough, so the following problems often occur when it is used in SMT printing: the inward bending of the screen frame under high tension will make the tension of the steel sheet uneven, resulting in uneven printing of solder paste. The distortion of the screen frame will cause the two surfaces of the steel sheet and the PCB to not be in close contact; the warping of the screen frame will cause gaps in the contact surface between the steel sheet and the PCB, etc.
These will seriously affect the quality of printed solder paste

Method used

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  • Surface mounting technology print stencil net frame
  • Surface mounting technology print stencil net frame
  • Surface mounting technology print stencil net frame

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings and preferred embodiments.

[0024] figure 1 It is a sectional view of an existing screen frame, in which the cross section of the screen frame is rectangular, the upper side 1 of the original material is parallel and equal to the lower side 2 of the original material, and the left side 3 of the original material is parallel and equal to the right side 4 of the original material.

[0025] According to the theory of engineering mechanics, increasing the overall width of the section can improve the bending strength, but a certain width of the mesh 6 must be reserved on the SMT screen frame to ensure the tension of the steel sheet, so the method of extending the bottom edge size of the profile inward cannot be used. Improve the bending strength of the screen frame, and at the same time, the four sides of the lower periphery of the screen frame have fixed specifications, so i...

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Abstract

The invention discloses a printing template screen frame of a surface sticking technology; the middle width of the section of the proximate matter of the screen frame is larger than the width of the lower side; as the middle width of the section of the proximate matter of the screen frame is designed to be larger than the width of the lower side, the invention can improve the anti-bending intensity of the screen frame under the situation of being capable of preserving net yarn with a certain width needed by the tension of a steel sheet, thereby improving the quality of the printing solder paste. The invention also relates to a method for manufacturing the section of the proximate matter of the screen frame.

Description

technical field [0001] The invention relates to printing technology, and more specifically, relates to a SMT printing template screen frame and a manufacturing method thereof. Background technique [0002] Printing stencils are used in a wide range of applications, especially in the field of screen printing. Due to the development of the electronic manufacturing industry, the stencil printing process has also been applied in the electronic manufacturing industry, and the SMT printing stencil is a typical example. SMT (Surface mounting technology) means surface mount technology. In the manufacturing process of electronic products, to solder electronic components and PCBs, you need to put tin on the PCB first, and there are hundreds of pads on the PCB that need to be mounted. Tin, the position of each pad corresponds to the electronic component. The best way to accurately tin the pads that need to be tinned at one time is to print. The commonly used method in the electronics...

Claims

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Application Information

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IPC IPC(8): B41F15/36H05K3/34
Inventor 杨昀
Owner SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD