Solid-state imaging device, color filter, camera, and method for manufacturing the color filter
By using color filters composed of multiple colored layers in solid-state imaging devices, the problems of flash and noise caused by color filters are solved, image quality is improved, and more uniform light transmission and higher image quality are achieved.
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no. 1 example
[0044] (device structure)
[0045] figure 1 The configuration of the camera 40 according to the first embodiment of the present invention is shown.
[0046] as in figure 1 As shown in , a camera 40 includes a solid-state imaging device 1 , an optical system 42 , a drive circuit 43 and a signal processing circuit 44 . The corresponding devices are described in order below.
[0047] The solid-state imaging device 1, on its light-receiving surface, receives light from an object image through the optical system 42, and then performs photoelectric conversion on the light to generate signal charges. The solid-state imaging device 1 is driven according to a drive signal output from the drive circuit 43 . Specifically, the solid-state imaging device 1 reads out signal charges and outputs them as raw data. Details of the solid-state imaging device 1 are described below.
[0048] The optical system 42 includes, for example, an optical lens, and forms an object image on the light-r...
no. 2 example
[0115] (device structure)
[0116] Figure 8 is a sectional view of a solid-state imaging device 1 according to a second embodiment of the present invention. Figure 8 The main part of the cross section taken along the line A-B in FIG. 2 , that is, the part from the pixel area PA across the peripheral area SA is shown. and Figure 4 As in , the pixel P is located on the substrate 101 in the pixel area PA. However, each element constituting the pixel P is not shown except for the photodiode 21 . In addition, peripheral circuits located in the peripheral area SA are not shown.
[0117] 9A and 9B are enlarged plan views of a color filter 301 according to a second embodiment of the present invention. Part A-B in FIGS. 9A and 9B corresponds to part A-B in FIG. 2 , and FIGS. 9A and 9B show a plane around part A-B. FIG. 9A shows the upper surface of the color filter 301, while FIG. 9B shows the lower layer below the upper layer with dashed lines.
[0118] Such as Figure 8 , ...
no. 3 example
[0141] (device structure)
[0142] Figure 11 is a sectional view of a solid-state imaging device 1 according to a third embodiment of the present invention. Figure 11 The main part of the cross section taken along line A-B in FIG. 2 is shown, that is, the part across the peripheral area SA from the end of the pixel area PA. and Figure 4 As in , the pixel P is located on the substrate 101 in the pixel area PA. However, each element constituting the pixel P is not shown except for the photodiode 21 . In addition, peripheral circuits located in the peripheral area SA are not shown.
[0143] Figure 12A and 12B is an enlarged plan view of a color filter 301 according to a third embodiment of the present invention. Figure 12A and 12B Part A-B in corresponds to part A-B in Fig. 2, and Figure 12A and 12B The plane around part A-B is shown. Figure 12A shows the upper surface of the color filter 301, while Figure 12B The lower layer below the upper layer is shown in ...
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