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Connection structure between printed circuit board and electronic component

一种配线电路基板、电子部件的技术，应用在印刷电路零部件、电气连接印刷元件、电路等方向，能够解决端子部间距离变短等问题

Inactive Publication Date: 2009-01-07
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, as the pitch of the printed circuit board becomes finer, the distance between adjacent terminal parts becomes shorter
Therefore, when heat welding is performed, the molten tin plating layer contacts each other between adjacent terminal parts, and a short circuit may occur.

Method used

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  • Connection structure between printed circuit board and electronic component
  • Connection structure between printed circuit board and electronic component
  • Connection structure between printed circuit board and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Next, a connection structure between a printed circuit board and an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

[0026] (1) Structure

[0027] figure 1 (a) is a plan view of the printed circuit board of this embodiment, figure 1 (b) is figure 1 (a) P-P cross-sectional view of the printed circuit board.

[0028] Such as figure 1 (a) and figure 1 As shown in (b), the printed circuit board 50 has the insulating base layer 1 made of, for example, polyimide. A rectangular region S is provided on the insulating base layer 1 . A plurality of wiring patterns 2 are formed to extend from the inner side to the outer side of two sides of the region S that face each other.

[0029] Each wiring pattern 2 includes a front end portion 21, a connection portion 22, and a signal transmission portion 23 ( figure 1 (a)). The width of the front end portion 21 and the width of the signal transmission port...

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PUM

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Abstract

The invention provides a connection structure between a wiring circuit board and an electronic component. Each wiring pattern is composed of a conductor layer and a tin plating layer, and includes a tip portion, a connection portion and a signal transmission portion. The width of the tip portion is equal to the width of the signal transmission portion, and the width of the connection portion is smaller than the widths of the tip portion and the signal transmission portion. The connection portions of wiring patterns and bumps of an electronic component are connected to one another, respectively, by heat-sealing when the electronic component is mounted. Respective distances A1, A2 are set to not less than 0.5 [mu]m. Respective distances B1, B2 are set to not less than 20 [mu]m. The thickness of the tin plating layer is set to not less than 0.07 [mu]m and not more than 0.25 [mu]m.

Description

technical field [0001] The present invention relates to a connection structure between a printed circuit board and electronic components. Background technique [0002] Various electronic components such as semiconductor chips are mounted on the printed circuit board. In this case, for example, the terminal portion of the printed circuit board and the terminal of the electronic component are connected by heat welding (for example, JP 2006-13421 A). Specifically, for example, a tin (Sn) plated layer is formed to cover the surface of the terminal portion of the printed circuit board, and the tin plated layer at the terminal portion is thermally melted when electronic components are mounted. Thereby, the terminal portion of the printed circuit board and the terminal of the electronic component are reliably connected. [0003] However, as the pitch of the printed circuit board becomes finer, the distance between adjacent terminal portions becomes shorter. Therefore, when heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/498H05K3/34H05K1/18H05K1/11
CPCH05K3/3473H05K2201/09381H05K3/3436H05K2201/09727H05K2201/10674H01L2224/16225H05K3/3442H05K1/111H05K2201/09427Y02P70/50
Inventor 江部宏史石丸康人
Owner NITTO DENKO CORP