Fixed mounting method of hot melt wax double heating of micro-dimension superconduction tunnel junction

Abstract

A fixed setting method of hot melt wax reheating for micro-dimension superconductive tunnel junction comprises: (1) arranging a superconductive SIS chip in a mounting slot, adjusting its position; (2) arranging two hot melt waxes at two ends of the chip; (3) arranging a frequency mixer base on a heat plate whose temperature is 10 to 20 degrees lower than the fusion point of the waxes; (4) removing the frequency mixer base when the hot melt waxes are soft, pressing and moving the soft waxes to cover two ends of the chip effectively and attach the bottom of the mounting slot; (3) finely adjusting the chip to complete positioning; (6) arranging the frequency mixer base on the heat plate, increasing the temperature of the heat plate until not lower than the fusion point of the waxes, removingthe frequency mixer base to be cooled at normal temperature when the waxes are completed fused to liquid; (7) using general spot welding to connect two ends of the chip to ground and to intermediate frequency micro-strip lines. The invention has improved mounting success rate, firm fixation, application at low temperature and no pollution on the surface of devices and the mounting slot.

Description

technical field [0001] The invention relates to an instrument preparation method, in particular to a fixed installation method for secondary heating of hot-melt wax for micro-sized superconducting tunnel junctions. Background technique [0002] Superconducting tunnel junctions, also known as superconducting SIS chips, are widely used in astronomical receivers and have extremely high sensitivity detection devices. The specific size of the superconducting SIS chip is related to the working frequency. The higher the frequency, the smaller the chip size (narrower and thinner). In actual work, the superconducting SIS chip is used as a detector, and it should be installed in an installation groove slightly larger than the chip size (the installation groove is a part of the base of the superconducting mixer). [0003] The development and application of superconducting tunnel junctions initially started from low frequency (about 0.1THz). In lower frequency bands, niobium (Nb) is c...

AI Technical Summary

Problems solved by technology

For a chip with a thickness of less than 50 microns, when one end is tightly fixed, the other end will inevitably be upturned, making it extremely difficult to achieve spot welding on the IF end

On the one hand, the chip may be directly broken by the ultrasonic vibration of the needle due to the vibration of the device during spot welding; Upturned, so that the solder joints cannot be separated or even the film is peeled off

[0010] 3) Indium has excellent ductility, which is the main reason for using indium for fixing and grounding, but it also brings a disadvantage, that is, the good adhesion causes indium to adhere to the bottom of the installation groove and is not easy to remove

For example: a) Using silver glue: Since silver glue is conductive, it can only be fixed at one end, and the upturning phenomenon of the intermediate frequency end of small devices cannot be completely solved, and the silver glue takes a long time to cure, which takes several hours, and the efficiency is too low ; b) Using quick-drying glue: Although it can be fixed at both ends, the quick-drying glue is not resistant to low temperature. Normal use; c) Relatively thick liquid glue: If the fixation is not good, the position of the device will move slightly, and sometimes if the glue flows into the waveguide, it will directly cause the detector to fail to work normally

Images