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Placement head comprising a readjusting mechanism, and placement robot

An assembly head and gripping device technology, which is applied to electrical components, electrical components, etc., can solve the problems that the restoring force cannot be predetermined, the placing force cannot be predetermined, and the assembly process is adversely affected, so as to achieve weight and cost advantages, structure The effect of compactness and improved dynamics

Inactive Publication Date: 2009-02-11
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, neither springs nor cylinders can be used to optimally predetermine the restoring force and thus also the setting force
In severe cases, this can also damage the component or substrate, which can adversely affect the assembly process
In addition to this, cylinders and springs age and require regular maintenance

Method used

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  • Placement head comprising a readjusting mechanism, and placement robot
  • Placement head comprising a readjusting mechanism, and placement robot
  • Placement head comprising a readjusting mechanism, and placement robot

Examples

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Embodiment Construction

[0027] figure 1 Shown is an automatic assembly machine 1 for equipping substrates with electrical components. The substrate 2 to be assembled is transported by a conveying line 3 (for example a conveyor belt) to an assembly station, where it is equipped with electrical components, and then transported away from the assembly station. The assembly process is carried out by the assembly head 4 . The assembly head 4 is mounted on a positioning arm 5 and is movable on the positioning arm 5 in a direction (arrow x) parallel to the conveying direction (arrow x) of the substrate 2 . The positioning arm 5 is itself mounted on a support 6 straddling the conveying line 3 and is movable on the support 6 in a direction (arrow y) perpendicular to the conveying direction. The automatic assembly machine 1 also includes a control device 7 coupled with the positioning arm 5 and the assembly head 4 for controlling the moving process. A feeding device 8 is provided in the feeding area next to ...

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PUM

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Abstract

A placement head (4) comprises a holding device (10) for holding components (11) and is received on a housing (9) so as to be displaced in a direction of displacement between a rest position and a working position, the rest position and the working position being interspaced by a travel path (Delta z) in the direction of displacement.; The placement head also comprises a readjusting mechanism (12) with a permanent magnet (14) which is magnetized at a right angle to the direction of displacement, a magnetic return path element (15) which interacts with the permanent magnet (14) in such a manner as to generate magnetic flux, the permanent magnet (14) being displaceable by the travel path (Delta z) in the direction of displacement relative to the magnetic return path element (15), and the magnetic return path element (15) comprising at least two sections (A, B) of different magnetic resistance in the direction of displacement and being configured in such a manner that the permanent magnet (14) overlaps at least two sections (A, B) at a time of the magnetic return path element (15) when it is displaced across the travel path (Delta z).; The readjusting mechanism (12) is coupled to the housing (9) and the holding device (10) in such a manner that the readjusting mechanism (12) exerts a readjusting force (F) on the holding device (10) across the travel path (Delta z), said readjusting force forcing the holding device (10) into the rest position.

Description

technical field [0001] The invention relates to a mounting head for equipping a substrate with electrical components and an automatic mounting machine with the mounting head. Background technique [0002] There are many examples in the field of technology where operations on components are required, such as the field of placement technology. The assembly technique is to equip the substrate with electrical components. The assembly process is carried out by the assembly head, which can move on the substrate to be assembled under the action of the two-dimensional positioning system. Wherein, the assembly head has one or more gripping devices, which are movable between a rest position and a working position in a direction perpendicular to the surface of the substrate. When carrying out the working process (ie picking or placing components), the gripping device is moved to the working position under the action of a suitable electric drive. During periods when the gripping devi...

Claims

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Application Information

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IPC IPC(8): H05K13/04
CPCH05K13/0413H05K13/0409
Inventor 斯蒂芬·伯格
Owner ASM ASSEMBLY SYST GMBH & CO
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