Placement head comprising a readjusting mechanism, and placement robot

An assembly head and gripping device technology, which is applied to electrical components, electrical components, etc., can solve the problems that the restoring force cannot be predetermined, the placing force cannot be predetermined, and the assembly process is adversely affected, so as to achieve weight and cost advantages, structure The effect of compactness and improved dynamics

Inactive Publication Date: 2009-02-11
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, neither springs nor cylinders can be used to optimally predetermine the restoring force and thus also the setting force
In severe cases, this can also

Method used

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  • Placement head comprising a readjusting mechanism, and placement robot
  • Placement head comprising a readjusting mechanism, and placement robot
  • Placement head comprising a readjusting mechanism, and placement robot

Examples

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Example Embodiment

[0027] figure 1 The display is an automatic assembly machine 1 used to equip the substrate with electrical components. The substrate 2 to be assembled is transported by a conveyor line 3 (for example, a conveyor belt) to the assembly location, where it is equipped with electrical components, and then it is transported away from the assembly location. The assembly process is implemented by the assembly head 4. The assembly head 4 is mounted on the positioning arm 5 and can move on the positioning arm 5 in a direction (arrow x) parallel to the conveying direction (arrow x) of the substrate 2. The positioning arm 5 itself is installed on the bracket 6 across the conveying line 3, and can move on the bracket 6 in a direction (arrow y) perpendicular to the conveying direction. The automatic assembly machine 1 also includes a control device 7, which is coupled with the positioning arm 5 and the assembly head 4 for controlling the movement process. A feeding device 8 is provided in the...

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PUM

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Abstract

A placement head (4) comprises a holding device (10) for holding components (11) and is received on a housing (9) so as to be displaced in a direction of displacement between a rest position and a working position, the rest position and the working position being interspaced by a travel path (Delta z) in the direction of displacement.; The placement head also comprises a readjusting mechanism (12) with a permanent magnet (14) which is magnetized at a right angle to the direction of displacement, a magnetic return path element (15) which interacts with the permanent magnet (14) in such a manner as to generate magnetic flux, the permanent magnet (14) being displaceable by the travel path (Delta z) in the direction of displacement relative to the magnetic return path element (15), and the magnetic return path element (15) comprising at least two sections (A, B) of different magnetic resistance in the direction of displacement and being configured in such a manner that the permanent magnet (14) overlaps at least two sections (A, B) at a time of the magnetic return path element (15) when it is displaced across the travel path (Delta z).; The readjusting mechanism (12) is coupled to the housing (9) and the holding device (10) in such a manner that the readjusting mechanism (12) exerts a readjusting force (F) on the holding device (10) across the travel path (Delta z), said readjusting force forcing the holding device (10) into the rest position.

Description

technical field [0001] The invention relates to a mounting head for equipping a substrate with electrical components and an automatic mounting machine with the mounting head. Background technique [0002] There are many examples in the field of technology where operations on components are required, such as the field of placement technology. The assembly technique is to equip the substrate with electrical components. The assembly process is carried out by the assembly head, which can move on the substrate to be assembled under the action of the two-dimensional positioning system. Wherein, the assembly head has one or more gripping devices, which are movable between a rest position and a working position in a direction perpendicular to the surface of the substrate. When carrying out the working process (ie picking or placing components), the gripping device is moved to the working position under the action of a suitable electric drive. During periods when the gripping devi...

Claims

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Application Information

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IPC IPC(8): H05K13/04
CPCH05K13/0413H05K13/0409
Inventor 斯蒂芬·伯格
Owner ASM ASSEMBLY SYST GMBH & CO
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