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Wafer, test system thereof, test method thereof, and test fixture thereof

A technology of wafer testing and fixtures, which is applied in semiconductor/solid-state device testing/measurement, electronic circuit testing, single semiconductor device testing, etc., to achieve the effect of reducing test time

Inactive Publication Date: 2009-04-01
HIMAX TECH LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The wafer under test has a plurality of chips

Method used

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  • Wafer, test system thereof, test method thereof, and test fixture thereof
  • Wafer, test system thereof, test method thereof, and test fixture thereof
  • Wafer, test system thereof, test method thereof, and test fixture thereof

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Embodiment Construction

[0044] Generally speaking, the CP test on the chip can be divided into two stages: HVS test and functional test. Taking the chip of the source driver as an example, the functional test not only needs to provide a test signal to the input terminal of the chip, but also needs to detect whether the signal at the output terminal of the chip is normal, so about 600-700 probes are needed to perform the functional test. .

[0045] It is worth noting that the purpose of the HVS test is to give the chip a higher than the rated operating voltage, so that the defective chip will deteriorate in a very short time, so that the defective chip can be detected more easily during the functional test. chip. Therefore, in practical applications, when performing HVS testing, it is only necessary to provide a test signal to the input terminal of the chip so that the chip is in a high-voltage operation state. "Is the chip normal?", then it can be tested together when the chip is functionally teste...

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PUM

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Abstract

The invention provides a crystal plate, a testing system, a testing method and a testing device thereof. The invention utilizes a first group probe to carry out high voltage stress test on a first chip and utilizes a second group probe to carry out function test on a second chip; wherein, the high voltage stress test and the function test are carried out simultaneously, thus greatly reducing the testing time of the crystal plate.

Description

technical field [0001] The present invention relates to a wafer and its testing technology, and in particular to a wafer and its testing technology which can shorten the testing time. Background technique [0002] When the chip is still in the wafer stage, a chip probe (Chip Probe, hereinafter referred to as CP) test must be performed on each chip in the wafer to filter out defective chips and reduce manufacturing costs. There are generally two stages of common CP testing, which are high voltage stress (High Voltage Stress, hereinafter referred to as HVS) testing and functional testing. Among them, the HVS test is to give the chip an operating voltage exceeding the specification (or specification) of the chip in a very short period of time, and at the same time give some basic signals required by the chip so that the chip can be operated under an excessively high operating voltage. operate. When the chip is operated at an excessively high operating voltage, the defects of ...

Claims

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Application Information

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IPC IPC(8): G01R31/00G01R31/26G01R31/28G01R1/073H01L21/66
Inventor 辜宗尧陈建儒张进添陈英烈卜令楷
Owner HIMAX TECH LTD
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