Laser cutting method for PCB plate

A PCB board and laser cutting technology, which is applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of printed circuit damage, low processing efficiency, and printed circuit short circuit, so as to reduce residue, improve yield, reduce The effect of PCB board short circuit

Inactive Publication Date: 2009-04-08
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This processing method produces a certain force due to the contact cutting between the tool and the PCB board, which causes the printed circuit on the PCB board to be damaged due to the force, and the yield is low.
Due to the particularity of the PCB board material, the cutting surface of the PCB board is easy to carbonize after direct laser cutting
The carbides produced by carbonization are conductive, an

Method used

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Examples

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Embodiment Construction

[0015] The PCB laser cutting method of this embodiment adopts the method of laser cutting the PCB board and laser cleaning the cut section to carry out laser cutting on the PCB board whose thickness is less than 3 mm.

[0016] Firstly, the PCB board is cut by laser. Use a laser to cut at the specified position on the PCB board. At present, the commonly used laser is CO2 laser, the power is 100W-400W, and the power depends on the thickness of the PCB board. If the thickness of the PCB board is large, or the power of the laser is not enough, or the cutting speed is too fast, and the PCB board cannot be cut off in one cut, the cutting step can be repeated until the PCB is cut off. Laser cutting will not produce a force similar to mechanical cutting on the PCB, so the printed circuit on the PCB will not be damaged due to the force.

[0017] The base material of the PCB board is an insulating material, which will be carbonized after cutting under the high temperature of the laser...

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Abstract

The invention discloses a laser cutting method for a PCB, which comprises the following steps: (1) the PCB board is cut off, wherein laser is adopted to cut the PCB at the specified position of the PCB for at least one time until the PCB is cut off; and (2) the cross section of an incision is cleaned, wherein laser with different parameters are adopted to grind the cross section of the incision of the PCB according to the thickness of the PCB so as to ensure that a black substance at the cutting cross-section of the PCB is vaporized. A step of middle-high negative pressure smoke suction is also adopted when the PCB is cut off and the cross section of the incision is cleaned. The method can effectively vaporize carbide at the incision, reduce the short circuit of the PCB caused by the carbide, reduce production cost, and improve the rate of finished products.

Description

【Technical field】 [0001] The invention relates to the field of laser cutting, in particular to a method for laser cutting a PCB board. 【Background technique】 [0002] With the rapid development of modern processing technology, modern laser processing technology has been increasingly used to replace traditional mechanical processing technology in many fields. In the PCB board cutting industry, in the past, mechanical CNC milling and other methods were mainly used to cut PCB boards. In this processing method, due to the use of cutting tools in contact with the PCB board, a certain force is generated, which causes the printed circuit on the PCB board to be damaged due to the force, and the yield rate is low. Due to the particularity of the PCB board material, the cutting surface of the PCB board is easy to carbonize after direct laser cutting. The carbides produced by carbonization are conductive, and the residual carbides are likely to cause a short circuit on the printed ci...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/16
Inventor 高云峰汪葛明杨锦彬李斌程文胜胡安安伍方买
Owner HANS LASER TECH IND GRP CO LTD
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