Substrate constant temperature technology for preparing direct current arc discharge PCVD diamond film

A diamond film, arc discharge technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, can solve the problem that the substrate temperature cannot be guaranteed, and achieves good disassembly performance, convenient experimental process, and good linearity. Effect

Inactive Publication Date: 2009-04-22
CHENGDU UNIVERSITY OF TECHNOLOGY
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Problems solved by technology

[0009] At present, in the plasma chemical vapor phase diamond film deposition equipment, most of the glass rotameters are used as the open-loop control mode of the actuator, which can only maintain a constant water flow rate. When the gas flow rate, plasm

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  • Substrate constant temperature technology for preparing direct current arc discharge PCVD diamond film
  • Substrate constant temperature technology for preparing direct current arc discharge PCVD diamond film
  • Substrate constant temperature technology for preparing direct current arc discharge PCVD diamond film

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Embodiment Construction

[0028] The present invention adopts automatic constant temperature device (as figure 1 ) and double thermocouple temperature technology, the substrate temperature in the preparation of DC arc discharge PCVD diamond film was measured and controlled. Now in conjunction with accompanying drawing, the present invention is described in further detail:

[0029] A. Double thermocouple temperature measurement and temperature comparison

[0030] Such as figure 1 , shown in 2, 3, and 4, the armored thermocouple (9-1) is installed in the thermocouple sleeve (14) inside the water-cooled base bracket device (2), and the armored thermocouple (9-2) is installed in the The flat head screw (16) and the "O" type sealing ring (12-8) are fixed in the polysulfone flange (4-2) on the right side of the reaction chamber (1), and the "O" type sealing ring (12-9 ), lock nuts (6-4) are fixed, and the two are used to measure the temperature of the back and side parts of the substrate workpiece respect...

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Abstract

The invention discloses a substrate automatic constant temperature technology for the preparation of a PCVD diamond film through direct current arc discharge, which is characterized by adopting a dual thermoelectric couple to measure and correct the temperature on the lateral surface and the back surface of a substrate respectively, using a closed loop control system consisting of a PID regulator with negative feedback function, a backup manipulator and an electric regulating valve to perform precise temperature control, and developing windows human-machine interaction interface based on a BT2000 industrial control configuration software platform for monitoring the temperature, the valve position and the depositing process, and acquiring and storing data. The technology has high control precision and convenient operation so that the technology is extremely suitable for preparing the plasma chemical vapor deposition (PCVD) diamond film through the direct current arc discharge.

Description

1. Technical field [0001] The invention relates to a substrate automatic constant temperature technology for chemical vapor deposition, in particular to a substrate automatic constant temperature technology for DC arc discharge plasma chemical vapor phase diamond film deposition. 2. Background technology [0002] Diamond has many superior physical and chemical properties, and it has been widely regarded as a new material in the 21st century. At present, the preparation methods of diamond mainly include high temperature and high pressure method and chemical vapor phase method. Polycrystalline diamond prepared by chemical vapor phase method (CVD) is very suitable for wide application as superhard wear-resistant coating, optical window, electronic heat sink, doped semiconductor and sensor, and its market potential is huge. At present, the methods for preparing CVD diamond films mainly include hot wire method, microwave method, DC arc discharge method and so on. The preparation...

Claims

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Application Information

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IPC IPC(8): C23C16/54C23C16/52C23C16/27
Inventor 汪灵张湘辉龙剑平
Owner CHENGDU UNIVERSITY OF TECHNOLOGY
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