Solder ball loading method and solder ball loading apparatus

A technology of solder balls and solder pads, which is applied in the direction of tin feeding devices, welding equipment, and printed circuits assembled by electrical components, which can solve the problems of solder bump peeling and achieve high uniformity and good wettability

Inactive Publication Date: 2009-04-29
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the method of mounting solder balls using the above-mentioned cylindrical member, when solder balls are reflowed to form solder bump

Method used

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  • Solder ball loading method and solder ball loading apparatus
  • Solder ball loading method and solder ball loading apparatus
  • Solder ball loading method and solder ball loading apparatus

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0043] The solder ball mounting device 20 of the first embodiment can transport the solder balls by moving the ball array mask 16 and the printed wiring board 10 by fixing the mounting cylinder 24. In addition, by fixing the ball array mask 16 and the printed wiring board 10, the mounting cylinder 24 may be moved to transport the solder balls.

[0044] Refer to showing the cross section of the mounting tube 24 figure 2 The structure of the mounting tube 24 will be described.

[0045] The mounting tube 24 is composed of a supply tube 26 for supplying inert gas and a suction tube 25 for sucking the supplied inert gas. The supply tube 26 is provided on the outer periphery of the suction tube 25, figure 1 The inert gas supplied through the pipe 26B from the inert gas cylinder 28 shown is discharged from between the opening 26A of the supply cylinder 26 and the lower end outer periphery 25C of the suction cylinder 25. On the other hand, using figure 1 The negative pressure generated...

Example Embodiment

[0063] Example 2

[0064] Picture 9 The mounting tube 125 of Example 2 is shown. Reference figure 2 The above-mentioned mounting cylinder has a double structure, and the inert gas is supplied from the supply cylinder 26 outside the suction cylinder 25. On the other hand, in Example 2, the nozzle 126 for supplying an inert gas is provided around the opening 125A of the mounting cylinder 125. Even if the structure of Example 2 is used, as in Example 1, it is possible to prevent the solder bumps from being drawn into the voids.

[0065] Next, the results of a comparative test between the solder bumps manufactured by the solder ball mounting method of Example 1 and the solder bumps manufactured by the method of sucking air to transport the solder balls will be described.

[0066] Example 1

[0067] (1) Production of printed circuit boards

[0068] Using a double-sided copper clad laminate (for example, MCL-E-67 manufactured by Hitachi Chemical Co., Ltd.) as a raw material, via-...

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Abstract

This invention provides a solder ball loading apparatus which enables fine solder balls to be loaded on pads while void is blocked from being caught into bump upon reflow. Inactive gas is supplied and the inactive gas is sucked from a loading cylinder located above a ball arrangement mask so as to gather solder balls. The gathered solder balls are rolled on the ball arrangement mask by moving the loading cylinder horizontally and the solder balls are dropped onto connecting pads on a multilayer printed wiring board through openings in the ball arrangement mask. Oxidation of the solder balls and mixture of voids upon reflow are prevented by loading the solder balls in the atmosphere of inactive gas.

Description

technical field [0001] The present invention relates to a solder ball mounting method and a solder ball mounting device for mounting solder balls forming solder bumps on a printed wiring board. Background technique [0002] JP 2006-74001 A discloses that solder balls are mounted on lands of a printed wiring board using a manufacturing method including the following steps. [0003] (1) The openings of the alignment mask are aligned with the pads of the printed wiring board. [0004] (2) Air is sucked by the cylindrical member, and the solder balls are collected on the alignment mask below the cylindrical member. [0005] (3) The cylinder member is moved so that the solder balls are mounted on the pads of the printed wiring board through the openings of the alignment mask. [0006] Patent Document 1: Japanese Patent Laid-Open No. 2006-74001 [0007] However, in the method of mounting solder balls using the above-mentioned cylindrical member, when solder balls are reflowed t...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCB23K3/0623H05K3/3478H05K2203/0557H05K2201/09481H05K3/4644H01L2224/11334H05K2203/0195H05K2203/082H01L2224/05568H01L2224/05573H01L2924/00014Y10T29/49147Y10T29/49149Y10T29/49204Y10T29/49222Y10T29/53204Y10T29/53209Y10T29/53213H01L2224/05599
Inventor 川村洋一郎丹野克彦
Owner IBIDEN CO LTD
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