Manufacture method and device of three-dimensional workpiece

A manufacturing method and technology of workpieces, applied in the field of manufacturing and equipment of three-dimensional workpieces

Inactive Publication Date: 2009-05-06
OUKESI INT
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  • Abstract
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Problems solved by technology

These two patents can use inorganic binders to make ceramic and ceramic workpieces, but they cannot be widely used in the manufacture of plastics, metals, ceramics and composite workpieces like selective laser sintering.

Method used

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  • Manufacture method and device of three-dimensional workpiece
  • Manufacture method and device of three-dimensional workpiece
  • Manufacture method and device of three-dimensional workpiece

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Embodiment Construction

[0063] The following content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be assumed that the specific implementation of the present invention is limited to these descriptions. For those of ordinary skill in the technical field of the present invention, without departing from the concept of the present invention, some simple deduction or replacement can be made, which should be regarded as belonging to the protection scope of the present invention.

[0064] figure 1- image 3 Explanation of main component symbols

[0065] 1a, powder; 1b, solvent; 1c, organic adhesive; 1d, additive; 2, slurry; 3, stirring device; 4, laying thin layer device; 5, green block; 6, workbench; 7, slurry Thin layer; 8. Heater; 9. Green thin layer; 10. Energy beam; 11. Workpiece thin layer; 12. Workpiece; 13. Green body removal container; 14. Disintegrant; 15. Rapid prototyping machine; 16 17. Energy beam sintering equipm...

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Abstract

The invention provides a method and equipment using organic adhesive mixed solvent and powder to manufacture three-dimensional workpieces. The work principle is as follows: the raw materials are stirred into slurry, which is laid as a green compact thin layer that can disintegrate in disintegrant; the green compact thin layer can form a workpiece thin layer that does not disintegrate in the disintegrant after scanned by an energy beam; in such a cycle, the steps of laying the thin layer and energy beam scanning are repeated, and then the three-dimensional workpiece can be formed; and the disintegant is used for separating the green compact not scanned by the energy beam from the workpiece, thus remaining the needed three-dimensional workpiece. The invention is widely applicable to manufacturing plastic, metallic, ceramic and compound workpieces, can avoid the defects of a selective laser sintering method, can use fine and very thin powder and therefore, can manufacture a finished product which is better than that made in the traditional selective laser sintering method in surface roughness and texture fineness, in addition, through subsequent densified sintering, the metallic and ceramic workpieces can have the strength superior to that in the traditional selective laser sintering method.

Description

technical field [0001] The invention relates to a method and equipment for manufacturing plastic material workpieces, ceramic and plastic composite material workpieces, metal and plastic composite material workpieces, and other composite material workpieces, in particular to the use of organic binders in layered processing to produce three-dimensional A manufacturing method and equipment for plastic material workpieces, three-dimensional ceramic and plastic composite material workpieces, three-dimensional metal and plastic composite material workpieces, and other three-dimensional composite material workpieces. Background technique [0002] Rapid prototyping methods can manufacture three-dimensional workpieces. Common methods include stereolithography (Stereolithography), selective laser sintering (Selective Laser Sintering), melt extrusion molding (Fused Deposition Modeling), thermal spraying (Thermo -Jet), wax spray modeling (Model Maker), etc., can be used to manufacture ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C67/00C04B35/64B22F3/105B05C5/00B05C11/04
CPCY02P10/25
Inventor 汤华兴
Owner OUKESI INT
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