Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, and can solve the problems of no decolorization prevention effect and inability to form resist patterns, etc.
CN101438208AInactive Publication Date: 2009-05-20ASAHI KASEI E-MATERIALS CORPORATION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ASAHI KASEI E-MATERIALS CORPORATION
Publication Date
2009-05-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

A photosensitive resin composition which is excellent in sensitivity, resolution, and adhesion, has satisfactory hue stability with respect to coloring and color fading during dry film storage, and can be developed with an alkaline aqueous solution; a layered photosensitive-resin product including the photosensitive resin composition; a method of forming a resist pattern on a substrate with the layered photosensitive-resin product; and a use of the resist pattern. The photosensitive resin composition is characterized by comprising: (a) 20-90 mass% thermoplastic copolymer which contains comonomer units derived from an a,ss-unsaturated carboxylated monomer and has an acid equivalent of 100-600 and a weight-average molecular weight of 5,000-500,000; (b) 5-75 mass% addition-polymerizable monomer having at least one terminal ethylenically unsaturated group; (c) 0.01-30 mass% photopolymerization initiator; (d) 0.01-5 mass% phosphorous ester compound; and (e) 0.001-0.3 mass% basic dye.
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Description

technical field

[0001] The present invention relates to a photosensitive resin composition capable of being developed by an alkaline aqueous solution, a photosensitive resin laminate obtained by laminating the photosensitive resin composition on a support, and a substrate using the photosensitive resin laminate A method of forming a resist pattern and uses of the resist pattern. More specifically, it relates to a photosensitive resin composition that provides a resist pattern suitable for the following applications: in the manufacture of printed wiring boards; in the manufacture of flexible printed wiring boards; in lead frames for mounting IC chips (hereinafter referred to as lead frame); metal foil precision machining, such as metal mask manufacturing; semiconductor package, such as BGA (Ball Grid Array Package) or CSP (Chip Scale Package); manufacturing by TAB (Tape Automated Bonding) or Manufacture of tape-shaped substrates represented by COF (chip on film: a material for...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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