Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, and can solve the problems of no decolorization prevention effect and inability to form resist patterns, etc.

Inactive Publication Date: 2009-05-20
ASAHI KASEI E-MATERIALS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the content shown therein is the effect of colorless leuco dyes that can prevent color development during high-temperature storage, and does not describe the effect of preventing discoloration during high-temperature storage in the case of using colored basic dyes, nor does it have any teach
Moreover, it is considered that the disclosed photosensitive composition cannot form a resist pattern

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
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Effect test

Embodiment

[0159] Hereinafter, examples of embodiments of the present invention will be described in detail through examples.

[0160] First, the preparation method of the samples for evaluation of the examples and comparative examples will be described, and then the evaluation method of the obtained samples and the evaluation results thereof will be shown.

[0161] 1. Preparation of samples for evaluation

[0162] The photosensitive resin laminates in Examples and Comparative Examples were prepared as follows.

[0163]

[0164] The photosensitive resin composition of the composition shown in Table 1 was fully stirred, mixed, and uniformly coated on a polyethylene terephthalate film (R310 manufactured by Mitsubishi Polyester Co., Ltd.) with a thickness of 16 μm as a support using a bar coater. The surface of -16) was dried in a dryer at 95° C. for 4 minutes to form a photosensitive resin layer. The thickness of the photosensitive resin layer was 40 μm.

[0165] Then, on the surface ...

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Abstract

A photosensitive resin composition which is excellent in sensitivity, resolution, and adhesion, has satisfactory hue stability with respect to coloring and color fading during dry film storage, and can be developed with an alkaline aqueous solution; a layered photosensitive-resin product including the photosensitive resin composition; a method of forming a resist pattern on a substrate with the layered photosensitive-resin product; and a use of the resist pattern. The photosensitive resin composition is characterized by comprising: (a) 20-90 mass% thermoplastic copolymer which contains comonomer units derived from an a,ss-unsaturated carboxylated monomer and has an acid equivalent of 100-600 and a weight-average molecular weight of 5,000-500,000; (b) 5-75 mass% addition-polymerizable monomer having at least one terminal ethylenically unsaturated group; (c) 0.01-30 mass% photopolymerization initiator; (d) 0.01-5 mass% phosphorous ester compound; and (e) 0.001-0.3 mass% basic dye.

Description

technical field [0001] The present invention relates to a photosensitive resin composition capable of being developed by an alkaline aqueous solution, a photosensitive resin laminate obtained by laminating the photosensitive resin composition on a support, and a substrate using the photosensitive resin laminate A method of forming a resist pattern and uses of the resist pattern. More specifically, it relates to a photosensitive resin composition that provides a resist pattern suitable for the following applications: in the manufacture of printed wiring boards; in the manufacture of flexible printed wiring boards; in lead frames for mounting IC chips (hereinafter referred to as lead frame); metal foil precision machining, such as metal mask manufacturing; semiconductor package, such as BGA (Ball Grid Array Package) or CSP (Chip Scale Package); manufacturing by TAB (Tape Automated Bonding) or Manufacture of tape-shaped substrates represented by COF (chip on film: a material for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/029G03F7/031G03F7/033H01L21/027H05K3/00
CPCG03F7/033G03F7/029G03F7/031
Inventor 姬田优香理富田宏朗足立辉彦
Owner ASAHI KASEI E-MATERIALS CORPORATION
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